Osram Opto Semiconductors Gmbh

Osram Oled Gmbh

Michael Müller

Roland Heinrich Enzmann

Zeljko Pajkic

Alexander Bachmann

The invention relates to an optoelectronic component comprising a carrier, an optoelectronic semiconductor chip arranged on the upper side of the carrier, and a frame which is arranged on the upper side of the carrier and which frames the optoelectronic semiconductor chip. An underside of the frame, which faces the upper side of the carrier, has at least one recess. In a spatial area framed by the frame on the upper side of the carrier, there is arranged a potting material which is in contact with the frame and at least partly fills the recess in the frame.

Optoelectronic component and method for producing same

The invention relates to a semiconductor laser diode () comprising: &#x2014;a semiconductor layer sequence () having an active region () provided for generating radiation; &#x2014;a radiation decoupling surface () which extends perpendicular to a main extension plane of the active region; &#x2014;a main surface () which delimits the semiconductor layer sequence in the vertical direction; &#x2014;a contact layer () which adjoins the main surface; and &#x2014;a heat-dissipating layer (), regions of which are arranged on a side of the contact layer facing away from the active region, wherein the contact layer is exposed in places for external electrical contact of the semiconductor laser diode. The invention also relates to a semiconductor component.

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Garching, Germany

Michael Müller