Kla Tencor Corporation

Foster-miller, Inc.

Ade Corporation

Michael Murphree

Neil Judell

Richard Earl Bills

Songping Gao

Chris Koliopoulos

Bruce W Baran

In a full duplex data transfer method system, a first transceiver and a second transceiver are configured to transmit and receive data packets. At the first transceiver, a status indicator is added to each data packet in a set of data packets and the status indicator of each data packet is initially set to not transmitted. A list of all data packets having a status indicator set to not transmitted is maintained. All data packets of the set are transmitted from the first transceiver to the second transceiver while the first transceiver receives transmissions from the second transceiver. At the second transceiver, all data packets received are saved and an indication regarding the data packets received are transmitted back to the first transceiver. At the first transceiver, the status indicator of all data packets in the list received by the second transceiver are set to received. The first transceiver then retransmits to the second transceiver all data packets of the set in the list having an indicator set to not transmitted.

Assured data transfer for full-duplex communication

A surface inspection system, as well as related components and methods, are provided. The surface inspection system includes a beam source subsystem, a beam scanning subsystem, a workpiece movement subsystem, an optical collection and detection subsystem, and a processing subsystem. The system features a variable scan speed beam scanning subsystem, preferably using an acousto-optic deflector, with beam compensation, so that variable scanning speeds can be achieved. Also included are methods and systems for improving the signal to noise ratio by use of scatter reducing complements, and a system and method for selectively and repeatedly scanning a region of interest on the surface in order to provide additional observations of the region of interest.

System and method for controlling a beam source in a workpiece surface inspection system

A system for inspecting semiconductor wafers capable of determining a scattering power associated with a wafer surface detect whether or not the scattering power exceeds the dynamic range of the system. The scattering power is obtained by determining the height of a Gaussian shape representing data collected by the system. The height is determined by defining a plurality of cross-sectional areas of the Gaussian shape, determining a value of each area, determining a value of the natural logarithm of intermediate heights of the Gaussian shape corresponding to the cross-sectional areas, plotting the area values as function of the natural logarithm of the intermediate height values to form a linear plot, determining a natural logarithm of the height value corresponding to a zero area value based on the linear plot, and determining the inverse natural logarithm of the value to obtain the height of the Gaussian shape.

Extended defect sizing

Growing community of inventors

North Attleboro, MA, United States of America

Michael Murphree