Atotech Deutschland Gmbh

Atotech Deutschland Gmbh & Co. Kg

Michael Merschky

Heiko Brunner

Jörg Schulze

Fabian Michalik

Thomas Thomas

Christian Lowinski

Stefanie Ackermann

Markku Lager

Birgit Beck

Johannes Etzkorn

Frank Brüning

Wonjin Cho

Felix Tang

Kilian Klaeden

Marco Haryono

Kuldip Johal

Valentina Belova-magri

Ting Xiao

Tatjana Königsmann

Anna Peter

Sebastian Reiber

Elisa Langhammer

Tobias Bernhard

Taybet Bilkay

The present invention relates to a method for increasing adhesion strength between a surface of a metal, a metal alloy or a metal oxide and a surface of an organic material comprising as a main step contacting of at least one section of said metal, metal alloy or metal oxide with a specific azole silane compound, a specific azole silane oligomer, or a mixture comprising said compound and/or said oligomer. Furthermore, the present invention relates to a use of said specific azole silane compound, said specific azole silane oligomer, or said mixture in a method for increasing adhesion strength between a surface of a metal, a metal alloy or a metal oxide and a surface of an organic material.

Method for increasing adhesion strength between a metal and an organic material

The present invention relates to a specific azole silane compound, an oligomer thereof, a mixture comprising said compound and/or said oligomer, as well as a respective storage and working solution. Furthermore, the present invention relates to a synthesis method for said specific azole silane compound, and the use of said working solution as a surface treatment solution.

Azole silane compound

The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.

Method for reducing the optical reflectivity of a copper and copper alloy circuitry and touch screen device

The invention relates to an electroless aqueous copper plating solution, comprising: a source of copper ions, a reducing agent or a source of a reducing agent, and a combination of complexing agents comprising i) polyamino disuccinic acid, polyamino monosuccinic acid, or a combination thereof, and ii) one or more of ethylenediamine tetraacetic acid, N'-(2-Hydroxyethyl)-ethylenediamine-N,N,N&#x2032;-triacetic acid, and N,N,N&#x2032;,N&#x2032;-Tetrakis (2-hydroxypropyl)ethylenediamine, as well as methods for electroless copper plating utilizing the solution and uses of the solution for the plating of various substrates.

Electroless copper plating solution

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Berlin, Germany

Michael Merschky