Heliatek Gmbh

Michael Meissner

Michael Eritt

Ralph Wichtendahl

Judith Geoerg

Merve Anderson

An encapsulation system, including a first encapsulation formed from at least one front barrier layer on a front face of the optoelectronic component and at least one rear barrier layer on a reverse face of the optoelectronic component with at least one first connecting material disposed in between, and a second encapsulation formed from at least one front protective layer on the front face of the optoelectronic component and at least one rear protective layer on the reverse face of the optoelectronic component with at least one second connecting material disposed in between, wherein the first encapsulation surrounds the optoelectronic component such that the first encapsulation projects beyond the optoelectronic component by a first edge region, and the second encapsulation surrounds the first encapsulation comprising the optoelectronic component such that the second encapsulation projects beyond the first edge region of the first encapsulation by a second edge region.

Encapsulation system for an optoelectronic component comprising at least a first encapsulation and a second encapsulation, and optoelectronic component comprising an encapsulation system of this kind

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Dresden, Germany

Michael Meissner