Infineon Technologies Ag

Qimonda Ag

Siemens Aktiengesellschaft

Infineon Technology Ag

Michael Markert

Stefan Dietrich

Thomas Hein

Christian Weis

Thilo Marx

Michael Bernhard Sommer

Patrick Heyne

Torsten Partsch

Peter Schr&ouml;gmeier

Sabine Kieser

Heinz Hoenigschmid

Sabine Sch&ouml;niger

Musa Saglam

Helmut Schneider

Helmut Fischer

Peter Schroegmeier

Peter Schrögmeier

Milena Ivanov

Milena Dimitrova

Peter Schrogmeier

Sabine Schoniger

Sabine Sch&ouml;niger Kieser

A memory chip with a plurality of FB DRAM cells, having a word line coupled to a first FB DRAM cell and a second FB DRAM cell is disclosed. The memory chip further has a first bit line coupled to the first FB DRAM cell, and a first state memory circuit coupled to the first bit line. The memory chip further includes a second bit line coupled to the second FB DRAM cell, and a second state memory circuit coupled to the second bit line. The memory chip further includes a sense amplifier, which can be coupled to the first FB DRAM cell, the second FB DRAM cell, the first state memory circuit or the second state memory circuit.

FB DRAM memory with state memory

An integrated circuit having a resistance-based or resistively switching memory cell, and a method for operating a resistively switching memory cell is disclosed. One embodiment is adapted to be put in a low-resistance state by applying a first threshold voltage and in a high-resistance state by applying a second threshold voltage, wherein reading out of the data content from the memory cell is performed by applying a voltage to the memory cell in the range of the first or second threshold voltage or a higher voltage.

Integrated circuit having a resistively switching memory and method

An integrated memory has row lines, column lines and column selection lines for activating read/write amplifiers. In each case, one group of a predetermined number of memory cells belongs to a row and a column address. Furthermore, the memory has a number of connecting pads corresponding to the predetermined number. Each memory cell in a group of memory cells is associated with one of the connecting pads. A control circuit for controlling the memory access is designed and can be operated such that, with a column address, it activates at least two different column selection lines. One of the column selection lines is activated for two or more column addresses. The delay times and the line lengths on the memory chip can thus be reduced in size.

Integrated memory, and a method of operating an integrated memory

Integrated circuits, in particular memory chips of the DDR SDRAM type, are tested in a parallel manner. In order to prevent the circuits from being driven relative to one another during a test operation, an input terminal that is already connected to a channel of an automatic test machine anyway is connected to a switching device, by which the output drivers can be turned off in a manner dependent on the control signal that can be fed in at the input terminal. The switching device preferably contains a demultiplexer and also a multiplexer. The demultiplexer can be driven by a test control signal that is additionally generated besides the test control signal. The input terminal is connected to a tester channel anyway during test operation, with the result that no additional external outlay arises.

Integrated circuit having a test operating mode and method for testing a multiplicity of such circuits

The voltage pump for generating a boosted output voltage has a switch-on control circuit. The switch-on control includes a transistor that is connected between a terminal for feeding in a supply voltage and the terminal for tapping off the boosted output voltage. After the voltage pump has started to operate, the boosted output voltage is decoupled from the supply voltage by the transistor. A changeover switch forwards the respective higher of the output voltage or supply voltage to the substrate terminal and gate terminal of the transistor. The switch-on control enables early provision of a boosted output voltage in conjunction with reliable start-up operation of the voltage pump, while the additional outlay on circuitry is minimized.

Voltage pump with switch-on control

A circuit configuration includes two signal path sections that are used to program the delay of a signal path, in particular in DRAMs. The two signal path sections have different delays and can be driven in parallel at the input end. The two signal path sections can be connected to an output terminal via a multiplexer. A selection circuit includes two signal path sections which are connected between supply voltage potentials. The selection circuit has two complimentary transistors which are connected in series and has source-end programmable elements. These transistors can be driven by complimentary control signals. This permits the delay to be programmed flexibly with little expenditure on circuitry.

Circuit configuration for programming a delay in a signal path

A layout of a sense amplifier configuration for a semiconductor memory is described. The layout has a plurality of read/write amplifiers, extending as strips in the form of rows one under the other, and having NMOS and PMOS transistors. At least one of the two driver transistors is disposed with its doping regions between the associated NMOS or PMOS transistors of the read/write amplifiers. A gate of the driver transistor is configured as a two-strip gate, in order to accelerate the signal evaluation in the sense amplifiers.

Layout of a sense amplifier with accelerated signal evaluation

The integrated memory has a first address path, via which the address terminals are connected to first selection lines of a first group and which has corresponding first lines and a first decoder circuit. In addition, the integrated memory has a second address path, via which the address terminals are connected to first selection lines of a second group and which has corresponding second lines and a second decoder circuit. The first decoder circuit is faster than the second decoder circuit. The first lines have a longer signal propagation time than the second lines.

Integrated memory

In a semiconductor memory, bit lines are disposed in such a way that in each case two inverted and two non-inverted bit lines lie next to one another. Adjacent switching transistors for connecting the bit lines to an inverted or a non-inverted collective line are connected to the corresponding collective line by a common contact. An advantage in terms of area is afforded by the fact that the two switching transistors have a common doping region.

Growing community of inventors

Augsburg, Germany

Michael Markert