Opto Power Corporation

Michael M Ung

Rushikesh M Patel

Lesley Rogers

Rajiv Agarwal

Robert Morris

Protection from current and voltage spikes is provided for a laser array by attaching a reverse diode laser array to shared contact pads before the first laser array is bonded to those pads. The arrangement provides for surge protection even during fabrication of the laser package where device failure results from power surges before surge protection circuitry is in place. Surge protection is afforded by having a reverse diode of the reverse diode array electrically in parallel with a corresponding laser diode of the protected array when activated.

Laser diode array with built-in current and voltage surge protection

A laser diode structure includes a metallic gasket which is sandwiched between the laser diode submount and the backside electrode in the absence of solder interfaces. The gasket has mirror image, shallow recesses in the surfaces thereof with each surface having the general shape of a wing. The recesses are formed into sealed coolant conduits when the several layers are bonded together into an integrated structure. The narrow end of each recess communicates with an aperture through the adjacent layer to provide inlet and outlet ports for the coolant. The gasket has an aperture therethrough at the wide ends of the recesses for the coolant to circulate. The gasket can be formed from a single layer or from two layers each with a single recess.

Laser diode structure with integrated heat sink

An assembly of simple, like laser diode submounts or laser diode bars lend themselves to volume manufacturing techniques. Individual diodes, or diode bars are supported on electrically-insulating submounts which have electrically-isolated metallizations applied thereto for mounting on a single insulating plate and to one another in a stack and for mounting to a common heat sink.

Laser diode array

A laser package includes a housing and a subassembly to which the critical components of the laser package are mounted. The subassembly is structured to preserve component alignment even in the presence of thermal excursions by ensuring that any movement which might occur effects all the components in a way to preserve alignment. The subassembly is easily removable from the housing and thus permits replacement if a failure should occur. A reverse laser diode is included to provide a path for reverse currents which otherwise would be damaging to the active laser diode.

Laser package with permanently aligned critical components

A laser device includes a glass optical fiber secured in position to capture light output from the laser. The fiber is secured in position with solder directly to the glass of the fiber without any metallization of the fiber. The solder-only technique satisfies the critical requirement for preventing fiber movement over the lifetime standard for laser device with multimade lasers and multimode fibers.

Laser device and method of manufacture using non-metalized fiber

A laser package is designed for large scale assembly by machinig a piec3 part of relatively large dimensions where the part has a slot for holding a laser. The piece part is mounted on heatsink of like dimensions. A second piece part includes an elongated groove for holding a fiber lens plate where the second piece part is mounted against the edge of the heat sink such that the lens is properly aligned with the laser. Thus, the critical alignment of the laser and the fiber is achieved by the alignment of like dimensioned piece parts of relatively large dimensions.

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Ontario, CA, United States of America

Michael M Ung