Westinghouse Electric Corporation

Michael M Sopira

Richard N Thomas

Harvey C Nathanson

A focal plane array including a first integrated circuit for infrared radiation (IR) detection and a second integrated circuit for signal processing is assembled in a flip-chip structural configuration. Each integrated circuit includes an array of metallic contacts on a surface thereof for interconnection in the flip-chip arrangement. The contact array of the IR detector includes a substantially greater number of contacts than the contact array of the signal processor. Consequently, it is not a prerequisite to precisely align the two integrated circuits in a one-to-one contact relationship for the flip-chip bonding operation therebetween. Thus, each metallic contact of the signal processor may be roughly aligned and bonded to a corresponding group of metallic contacts of the IR detector array without altering significantly the operation of the overall focal plane array as long as at least one metallic contact of the IR detector array is included in each corresponding contact group. As a result of this structural improvement, a method of batch-fabricating a plurality of high-density focal plane arrays may be accomplished quite expeditiously.

Method of batch-fabricating flip-chip bonded dual integrated circuit

Self-aligned, flip-chip focal plane array configuration

An improved radiant energy sensor incorporating a number of elongated detectors, circuitry, and narrow grooves on a crystalline substrate is described which receives radiant energy in the direction of the elongated detectors where the elongated detectors are electrically and optically isolated from adjacent detectors by narrow grooves in the substrate and where the detectors hold the incident radiant energy within the detector by the reflection of the radiant energy from the side surfaces of the same narrow grooves.

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Pittsburgh, PA, United States of America

Michael M Sopira