Apple Inc.

Avago Technologies International Sales Pte. Limited

Michael M Li

Dale N Memering

Rajib Dutta

Christopher R Fagan

Anubhav Prasad

Palaniappan Chinnakaruppan

Matthew N Van Dyke

Samir Bhattacharya

Changbai He

Anthony J Richter

Tony Devadason Titus

Yulei Sun

Aravindu Maneti

Marwan Rammah

Brian M Gable

Jairam Manjunathaiah

Henry B Wettersten

Dakota A Bass

Logan M Ames

Raul Molina

Thomas Johannessen

Phillip W Hum

Laser-based techniques for cutting and drilling of transparent components are disclosed. These laser-based techniques rely on laser modification of transparent substrates followed by chemical etching and are suitable for use with a variety of transparent substrates. Transparent components and enclosures and electronic devices including the transparent components are also disclosed herein.

Laser-based cutting of transparent components for an electronic device

A colored sapphire material and methods for coloring sapphire material using lasers are disclosed. The method for coloring the sapphire material may include positioning the sapphire material over an opaque substrate material, exposing the opaque substrate material to a laser beam passing through the sapphire material to impact the substrate material, and inducing a chemical change in a portion of the sapphire material exposed to the laser beam. The method may also include creating a visible color in the portion of the sapphire material as a result of the chemical change. The colored sapphire material may include a first transparent portion, and a second, colored portion substantially surrounded by the first portion. The second, colored portion may have a chemical composition different than that of the first portion.

Laser-colored sapphire material

An electronic device may include a housing, a display positioned at least partially within the housing, a cover assembly coupled to the housing and comprising a chemically strengthened glass member, and an encoded marking formed within the chemically strengthened glass member between an upper surface and a lower surface of the chemically strengthened glass member. The encoded marking may include an array of marks, each mark of the array of marks having a dimension between about 3 microns and about 10 microns and set apart from an adjacent mark by an unmarked area of the chemically strengthened glass member. Each mark may represent a bit of information in a binary number system. The encoded marking may be readable, by an optical magnification apparatus, through the upper surface.

Electronic device enclosure with a glass member having an internal encoded marking

A laser-textured glass cover member suitable for use in an electronic device is disclosed. The laser-textured surface of the glass cover member may provide a smooth feel to an external surface of the electronic device without introducing a perceptible visual texture. Methods for making the laser-textured glass cover members are also disclosed.

Electronic devices including laser-textured glass cover members

A manufacturing method for sapphire crystal material is disclosed, including a laser-etched bar code formed into the interior of the sapphire crystal material. The laser-etched bar code may be associated with one or more manufacturing parameters or other manufacturing data. The sapphire crystal may be used to create a cover sheet for use with a display screen of a portable electronic device.

Laser marking process

Provided are systems, methods, and computer-readable medium for enabling sharing of a multi-channel packet processor by multiple processes executing on a network device. The network device can include a memory management unit, configured to include an address map. The address map can include a reserved portion. The virtual machine can allocate a guest portion in the address map, where the guest portion is allocated in a part of the address map that does not include the reserved portion. A first channel from the packet processor can be assigned to the guest portion, and the virtual machine can use the first channel to receive packets. The reserved portion can be assigned to a host process executing on the network device. A second channel from the packet processor can be assigned to the reserved portion. The host process can transmit packets to the network using the second channel.

Multichannel input/output virtualization

Anodized substrates having laser markings and methods for forming the same are described. According to some embodiments, the methods involve forming a feature on a substrate using a laser prior to anodizing. The laser energy and pulse width can be chosen so as to provide a particular topology to a surface of the substrate that, after anodizing, absorbs incoming light and imparts a dark appearance to the feature. In some cases, the methods involve forming a coarse oxide layer, which is removed prior to anodizing. Since the laser marking is performed prior to anodizing, the anodized substrates are free from laser-induced cracks, thereby making the anodized substrates more corrosion resistant than conventional laser-marked anodized substrates. The techniques are well suited for forming features on consumer products that may be exposed to water or other corrosion-inducing agents.

Anodized substrates with dark laser markings

A network device may execute a software keep-alive process (SKAP) that enables the network device to continue to send keep-alive packets without interruption even during events such as a network operating system failover/switchover or an in-place system upgrade. The network device maintains a database of keep-alive network sessions storing information that is used to schedule and send keep-alive messages or packets for the keep-alive network sessions. The database may be shared between network operating subsystems and programs executed by the network device. The database may be updated by a network operating subsystem and the information may then be used by the SKAP to schedule and send out keep-alive messages or packets for the keep-alive network sessions. For example, a virtual machine may store information for a keep-alive network session in the database, which is used by SKAP to schedule transmission of keep-alive packets for that keep-alive network session.

Keep-alive technique in a network device

A network device may execute a process (e.g., a software keep-alive process (SKAP)) that schedules the transmission of keep-alive messages or packets. The network device maintains a database of keep-alive network sessions storing information that is used for scheduling the transmission of the keep-alive messages or packets for the keep-alive network sessions. The database may be read and a next transmission time and session frequency for one or more keep-alive sessions may be determined. The one or more keep-alive sessions may then be placed in appropriate banks within a timer queue based on the determined next transmission time and session frequency. Each bank is associated with a time period from the current time. The keep-alive sessions having sooner next transmission times are placed in higher priority banks. The scheduler may allow for real-time scheduling of the one or more keep-alive sessions.

Keep-alive scheduler in a network device

A system and method of forming a sapphire component. The method may include disposing an absorptive-barrier layer on a first surface of a sapphire substrate, performing a cut in the sapphire substrate using a laser beam incident on the absorptive-barrier layer, and forming and removing molten sapphire from the cut. The method may also include shielding a region of the first surface that is adjacent to the cut from the molten sapphire using the absorptive-barrier layer, and removing the absorptive-barrier layer from the first surface of the sapphire substrate.

Coated substrate and process for cutting a coated substrate

A ceramic material, such as sapphire, is irradiated using a laser-based process to form a cut. In some implementations, a region of the ceramic material adjacent to the cut may be heated. The region may be removed to form an edge feature. In various implementations, the region of the ceramic material adjacent to the cut may be shielded from an outer portion of a laser beam used in the laser-based process using a shield, such as a polyethylene film. This removal and/or shielding operations may improve the mechanical strength of the ceramic material.

Enhancing strength in laser cutting of ceramic components

A system and a method for manufacturing a sapphire part. A sapphire substrate is obtained for performing a laser cutting operation. The sapphire substrate is cut along a cut profile using a laser and a first gas medium. The first gas medium is substantially comprised of an inert gas. The sapphire substrate is then irradiated at or near the cut profile using the laser and a second gas medium. The second gas medium is different than the first gas medium comprising oxygen.

System and method for laser cutting sapphire using multiple gas media

Welding of transparent material in electronic devices. An electronic device may include an enclosure having at least one aperture formed through a portion of the enclosure. The electronic device may also include a component positioned within the aperture formed through the portion of the enclosure. The component may be laser welded to the aperture formed through the enclosure. Additionally, the component may include transparent material. A method for securing a component within an electronic device may include providing an electronic device enclosure including at least one aperture, and positioning a component within the aperture formed through the enclosure. The component positioned within the aperture may include a transparent material. The method may also include welding the component to the electronic device enclosure.

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San Jose, CA, United States of America

Michael M Li