General Dynamics Mission Systems, Inc.

Michael M Holahan

Nick R Bober

Nicholas R Bober

A mounting frame apparatus is provided for embedding cards within an electronics system and includes a multi-card swappable subsystem. The apparatus further includes a chassis for containing the multi-card swappable subsystem. One or more heatsinks are used for cooling cards disposed in the four-card swappable subsystem.

Multi-card subsystem for embedded computing systems

A flow-through card rail module is provided in a circuit module chassis assembly for an embedded computing system. A set of elongated guide rails are formed on a base plate and define a card channel for receiving a circuit card. Each guide rail has a cooling passage extending from a fluid inlet to a fluid outlet. A corrugated structure is formed on an opposite side of the base plate and includes a set of elongated cells. Each elongated cell has a cooling passage formed therein extending from the fluid inlet to the fluid outlet. Internal walls subdivide the cooling passages formed in the guide rails and the elongated cells to form a honeycomb structure. The flow-through card rail module including the base plate, the guide rails and the corrugated structure may be formed as a monolithic component.

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Fairfax Station, VA, United States of America

Michael M Holahan