Rogers Corporation

Michael M Gottlieb

David S Fishman

Stephen J Etzel

Henri Buysse

A mounting or carrying device utilized in conjunction with an electronic component suitable for use on a printed wiring board, the electronic component being capable of adjusting the arrival time of signals in high speed logic systems is presented. Preferably, the electronic component is a time delay line device which is used in conjunction with the mounting or carrying device to form a delay line/carrier assembly for either surface mounting or through hole mounting onto a printed wiring board.

Carrier assembly for mounting a rolled coplanar delay line

A decoupling capacitor and method of manufacture thereof are presented wherein the decoupling capacitor is formed in an in-line assembly and insert molding process. The decoupling capacitor is a hermetically sealed capacitive unit consisting of a ceramic multilayer chip, active leads and molded lugs for auto-insertion into printed circuit boards.

Multilayer decoupling capacitor and method of manufacture thereof

A decoupling capacitor and method of manufacture thereof are presented wherein the decoupling capacitor is formed in an in-line assembly and insert molding process. The decoupling capacitor is a hermetically sealed capacitive unit consisting of a ceramic chip, active leads and molded lugs for auto-insertion into printed circuit boards.

Decoupling capacitor and method of manufacture thereof

A decoupling capacitor and method of manufacture thereof are presented wherein the decoupling capacitor is formed in an in-line assembly and insert molding process. The decoupling capacitor is a hermetically sealed capacitive unit consisting of a ceramic chip, active leads and molded lugs for auto-insertion into printed circuit boards. The active leads and molded lugs are on the same height level to promote symmetry and ease of handling.

Constructions of miniature bus bar assemblies which incorporate discrete capacitive elements having a high dielectric constant are presented herein. The capacitive elements are preferably metallized ceramic wafers which are bonded between a pair of bus bar conductors. In one embodiment bonding by strips of solder. In other embodiments, printed circuit elements are employed, both for electrical connection between the capacitor elements and the bus bars and to define the bus bars.

Bus bar assembly with discrete capacitor elements

A miniaturized bus bar and the method of production thereof wherein a sheet of insulating material is laminated between a pair of bus conductors and windows are provided in the laminated structure. A plurality of multilayer ceramic capacitors are inserted in the windows and alternate plates of the capacitors are electrically connected to the two bus conductors. The capacitors are comprised of alternating layers of conductive material and dielectric material.

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Kraainem, Belgium

Michael M Gottlieb