Raytheon Company

Michael M Fitzgibbon

Chad E Patterson

Ethan Santosh Heinrich

Duke Quach

John G Heston

Alberto F Viscarra

Kevin C Rolston

Samuel Doug Tonomura

John A Crockett, Jr

Anthony M Petrucelli

Cynthia Y Hang

Michael Benjamin Brown

Kevin P Agustin

A module. In some embodiments, the module includes a substrate; a plurality of electronic components, secured to an upper surface of the substrate; a thermally conductive heat spreader, on the electronic components and in thermal contact with an electronic component of the plurality of electronic components; a standoff, between the substrate and the heat spreader; an alignment element, extending into the substrate; a hard stop, under the substrate; and a plurality of compressible interconnects, under the substrate, and extending through the hard stop. The electronic components may be within a sight area of the substrate. The module may be configured to transmit a compressive load from an upper surface of the standoff to a lower surface of the substrate through a load path not including any of the electronic components.

Electronic module for motherboard

A board element for board-to-board interconnect formation is provided. An embodiment includes embedding a signal via element in the board element and cutting through respective sections of the board element and the signal via element to expose a new board element edge and an outwardly facing surface of the signal via element.

Extremely low profile electrical interconnect for printed wiring board

A coaxial electrical interconnect is disclosed. The coaxial electrical interconnect can include an inner conductor including an electrically conductive spring probe. The coaxial electrical interconnect can also include an outer conductor including a plurality of electrically conductive spring probes disposed about the inner conductor. Each spring probe can have a barrel and a plunger biased out of the barrel. The plunger can have a first plunger portion external to the barrel and a second plunger portion disposed partially in the barrel. The first and second plunger portions can have different diameters. A barrel of the spring probe of the inner conductor can be located proximate a plunger of at least one of the spring probes of the outer conductor.

Coaxial electrical interconnect

An integrated circuit system having: (A) a semiconductor chip with a signal strip conductor disposed on an upper surface of the chip; an active semiconductor device disposed of the upper surface of the chip electrically connected to the signal strip conductor; and a first ground plane conductor disposed on a bottom surface of the chip disposed under the signal strip conductor; and (B) a support structure having: a second ground plane disposed over, and separated from, the signal strip conductor by a dielectric region between the second ground plane and the signal strip conductor on the chip; a signal contact disposed on the bottom surface of the support structure displaced, electrically insulated, from the second ground plane conductor, and electrically connected to a portion of the signal strip conductor. The signal strip conductor, the first ground plane conductor, and the second ground plane conductor provide a stripline microwave transmission line.

Integrated circuit system having stripline structure

Growing community of inventors

Playa Del Rey, CA, United States of America

Michael M Fitzgibbon