International Business Machines Corporation

Jds Uniphase Corporation

Other

Michael Lynn Zumbrunnen

Gary Franklin Goth

Gerald Daniel Malagrino, Jr

Richard C Chu

Darryl John Becker

Phillip Duane Isaacs

James D Bielick

Douglas A Baska

Kevin P Moran

Michael J Ellsworth, Jr

Robert E Simons

Laura Marie Zumbrunnen

Edward O Donner

Brian Michael Kerrigan

Gaetano Paolo Messina

James Robert Moon

Johnny Roy Brezina

George T Galyon

Leland Leslie Day

George M Jordhamo

Richard Chao-Fan Chu

Jeffrey C Eid

Disclosed herein is a method to enable a user to use a hypothermia system to cool a body part involved in cancer therapy or in brain trauma. The method enables the user to operate the hypothermia system by her- or himself and still be mobile. The hypothermia system comprises a conformal cap system, a thermally conductive liquid located between the body part to be cooled and the cap system, thermal transfer fluids, phase change materials, thermally insulated cooler, physical measuring devices, mechanical and electrical components, a 'smart' user interface device, a battery, and an uninterruptible power controller. The method allows a user to control the rate of and temperature of cooling down the body part, exhibits parameters associated with the process of cooling the body part, provides alerts if necessary, is portable and entirely self-managed. The hypothermia device is in communication with and can be controlled by an application installed on a smart device, such as a phone. The method of using the hypothermia system can help to eliminate hair loss caused by the side effects of certain chemotherapy treatments or to reduce the metabolic rate of ischemic tissue to prevent or minimize the severity of swelling.

Method and apparatus of a self-managed portable hypothermia system

A non-user assisted, portable, entirely self-managed capable hypothermia device to eliminate hair loss caused by the side effects of certain chemotherapy treatments or to reduce the metabolic rate of ischemic tissue along with the severity of swelling is disclosed. The device consists of a conformal cap system, a thermally conductive liquid located between the body part to be cooled and the cap system, thermal transfer fluids, phase change materials, thermally insulated cooler, physical measuring devices, mechanical and electrical components, a 'smart' user interface device, a battery, and an uninterruptible power controller.

The present invention relates to an opto-electronic system including an opto-electronic module and a cage assembly for electrically connecting and securing the electronic module to a host computer device. Corresponding mechanical features are provided on the module and the cage assembly to prevent modules from being plugged into incompatible cage assemblies.

Optical cage system preventing insertion of incorrect module

The invention relates to a high density small form factor opto-electronic transceiver system in which the module housing and guide rail from a large form factor transceiver system, e.g. an Xtransceiver, are used to house a plurality of small form factor transceivers. Ideally up to four independently functioning pluggable small form factor transceivers are plugged into the module housing of the larger form factor transceiver, which has been modified to form a shell. The shell houses a printed circuit board, which has a plurality of electrical connectors on one end for receiving the transceivers, and a single electrical connector on the other end for plugging into a host system.

High density optical transceiver

The invention relates to an optical transceiver system for use in a host device including an optical transceiver receptacle or cage with a heat dissipating structure mounted thereon. The heat dissipating structure is electronically powered by an external source in the host device, which are electrically connected by insertion of a transceiver module into the transceiver receptacle. The present invention enables optical transceivers to support very high data rates, e.g. &#x3e;8 Gb/s, while still supporting very high density applications, e.g. SFF/SFP. Actuating features on the transceiver module and cage enable the heat dissipating structure to be turned on when the transceiver module is fully inserted into the cage, and turned off when the transceiver module is removed or at least partially removed from the cage.

Heat dissipating cages for optical transceiver systems

The invention relates to a bail latching device for an opto-electronic transceiver, including a pivotal latching member and a bail. The bail includes ends extending at an acute angle from a plane defined by the side arms for pivoting the latching member when the bail is rotated from a rest position to a removal position. Ideally, in the rest position, the side arms of the bail extend downwardly on each side of a front end of the transceiver. In the removal position, the bail is parallel to a removal direction, whereby the bail rotates the latching member to an unlatching position and then provides a handle to grasp while removing the transceiver from a standard cage.

Optical transceiver bail latch

An optical coupler and housing arrangement includes a housing portion adapted to receive an optical connector of a fiber optic cable, and further includes an optical coupler portion integrally formed with the housing portion. The optical coupler portion is adapted to transmit optical signals to and from the fiber optic cable. The optical coupler portion has a plurality of optical fibers for transmitting the optical signals. Each of the optical fibers extends from one end surface of the optical coupler portion to another end surface of the optical coupler portion. The housing portion has a recess for receiving the optical connector, with one of the end surfaces of the optical coupler portion forming a back surface of the recess.

Integrated optical coupler and housing arrangement

An apparatus for dissipating heat generated by an electronic device and a method for mounting the apparatus to an electronic device are disclosed. The apparatus includes a heat transfer body which is mounted in proximity to an electronic device. In addition, the apparatus includes an adhesive distributed on the heat transfer body, which affixes the heat transfer body in proximity to the electronic device. The adhesive is distributed on the heat transfer body such that heat transfer from the electronic device to the heat transfer body occurs substantially independently from the adhesive. The apparatus further includes a thermally conductive material disposed between the electronic device and the heat transfer body. The thermally conductive material is selected to maximize heat transfer from the electronic device to the heat transfer body.

Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device

Heat dissipation apparatus and method for attaching a heat dissipation

A new approach to providing thousands of contacts between electronic packages and their next package level by use of small formed spring contact elements (SCE) retained within a interposer structure or soldered directly into a printed circuit board or onto the module is disclosed. Each contact element can be either a signal or power line and, for improved electrical performance, alternate both horizontally and vertically in an orthogonal grid such that no signalling is adjacent to another signal. The spring contact elements (SCE) have multiple cross-sectional shapes and are pre-formed for improved mechanical performance. A retainer contains the multiplicity of SCE while providing a air plenum for improved thermal performance.

High density and high current capacity pad-to-pad connector comprising

A method of manufacturing thousands of contacts between electronic packages and their next package level by use of small wires retained within a interposer structure or soldered directly into a printed circuit board or onto the module. Each wire can be either a signal or power connection. The wires may have multiple cross-sectional shapes compared to one another and are preformed before assemble into an array retainer. The retainers contain the multiplicity of wires and are used for additional process steps and as the final housing of the connector assembly.

Process for manufacture of spring contact elements and assembly thereof

An improved electronic cooling module having thermally optimized and fully integrated vertical water channels located between pistons. The water channels include directed jets matched to the piston localized performance and an inner tube locally attached to the channel hole providing parallel convective surfaces.

Cooling by use of multiple parallel convective surfaces

A thermally optimized piston for use in a liquid cooled module. The thermally optimized piston has three distinctive sections, an upper tapered section, a central cylindrical section, and a lower diverging section. In a preferred embodiment, the thermally optimized piston is provided as part of an improved electronic module. The improved electronic module includes enhanced convective cooling channels disposed between the pistons.

Growing community of inventors

Rochester, MN, United States of America

Michael Lynn Zumbrunnen