Rogers Corporation

Michael Lunt

Karl Edward Sprentall

Kristi Dhimiter Pance

Gianni Taraschi

Murali Sethumadhavan

Dirk M Baars

Roshin Rose George

Stephen O'Connor

Bruce B Fitts

Michael S White

Christopher Brown

William Blasius

Sam Henson

John Dobrick

Trevor Polidore

Robert Mone

William Kwan

A sensor apparatus includes a first of a plurality of layers having a top layer, a bottom layer, and at least one intermediate layer having an electrical conductor layer, each of the top layer, the bottom layer, and the at least one intermediate layer is disposed in direct contact with a respective adjacent layer. A second of the plurality of layers is disposed in direct contact with the first plurality of layers such that the bottom layer of the second plurality of layers is disposed in direct contact with the top layer of the first plurality of layers. The first and second plurality of layers are productive of a piezoelectric voltage absent of an external current producing device and in response to being deformed, and are productive of a change in capacitance in response to being deformed.

Layered sensor apparatus and method of making same

An electromagnetic, EM, device, includes: a substrate having a dielectric layer and a first conductive layer at a first side of the substrate, the substrate having a via that extends at least partially through the substrate from the first side toward an opposing second side of the substrate; at least one dielectric structure having at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having a first average dielectric constant, the at least one dielectric structure further having a second dielectric portion that is contiguous with the first dielectric portion; wherein the second dielectric portion extends into the via of the substrate, the via having a mechanical interlock surface; and wherein the at least one dielectric structure includes a mechanical interlock between the second dielectric portion and the mechanical interlock surface of the via of the substrate.

Electromagnetic dielectric structure adhered to a substrate and methods of making the same

In an embodiment, an electromagnetic device, comprises a substrate a substrate comprising a dielectric layer and a first conductive layer; at least one dielectric structure comprising at least one non-gaseous dielectric material that forms a first dielectric portion that extends outward from the first side of the substrate, the first dielectric portion having an average dielectric constant and an optional second dielectric portion that extends into an optional via. The at least one dielectric structure is bonded to the substrate by at least one of: a mechanical interlock between the second dielectric portion and the substrate due to the at least one interlocking slot comprising a retrograde surface; an intermediate layer located in between the dielectric structure and the substrate having a roughened surface; or an adhesive material located in between the dielectric structure and the substrate. A method of making the device can comprise injection molding a dielectric composition onto the substrate to form the dielectric substrate.

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Scotland, CT, United States of America

Michael Lunt