Texas Instruments Corporation

E.pak International, Inc.

Michael Louis Hayden

Lee A Lewis

James Dove

Jeffrey Wilson

Kurodearimasu Takeshi Hirose

Keith W Melcher

Clessie A Troxtell, Jr

Jeffrey Allen Hanson

Robert Mark Reynolds

Patricia Ann Constandine

Song Ping Chen

James R Thomas

Clifton C Haggard

Ru Zheng Liu

Jason D Brown

Charles M Hess

Laura A Hnilo

Daniel R Wikander

Clessie Troxtell

Systems and methods and resulting compositions of matter including silicon solids from a mixture of silicon and water. The mixture is collected at a collection stage from at least one wafer abrasion process performed on a silicon surface having an impurity concentration &#x2266;0.1 ppb and extracting one portion of the water from the mixture using at least one dryer stage to form a dry cake. The dry cake includes at least 99.99% silicon by weight excluding water and non-silicon species, where a concentration of water in the dry cake is between 0.05% and 1% by weight, and where a concentration of non-silicon species in the dry cake is between 0.05% and 1% by weight.

System and method for production of high purity silicon solids and solids therefrom

A plastic cushion pad () includes at least one plastic spring portion () between oppositely facing contact surfaces (). In one example, the pad () is vacuum formed using a film of carbon-impregnated polystyrene material. The plastic spring portion () is configured to provide the desired amount of resiliency or cushion provided by the pad responsive to a compressive force. In one example, the plastic spring portion is designed to prevent any lateral deformation of the pad when a compressive force is applied.

Plastic packaging cushion

A containment device for retaining semiconductor wafers having a first housing member having a frame with inner and outer walls normal to the frame having a gapped relation. The inner wall receives the semiconductor wafers. A second housing member securably attachable to the first housing member by plural latches has a frame forming the top of the device. Each latch has a hook secured to the first housing member passing through a hole in the second housing member and releasably secured within the hole by the hook. In a second embodiment, the latches and holes are replaced with a plurality of rotatable latch members each having a hook at the distal end for engagement with a hole in the second housing member, secured to the first housing member and rotatable about a hinge. One wall of the first embodiment is replaced with a soft liner which absorbs shock.

Containment device for retaining semiconductor wafers

A carrier and cover tape assemblage for semiconductor devices which maintains integrity through bake temperature of 125 degrees C is provided by cover and carrier tapes of the same material, such as polycarbonate, and thus having the same thermal properties so that the joining adhesive is placed under minimal stress to cause delamination or distortion.

Matched thermal expansion carrier tape assemblage for semiconductor devices

A containment device for retaining semiconductor wafers ( ) which includes a first housing member ( ) having a frame ( ), an inner wall ( ) and an outer wall ( ), the inner wall ( ) and outer wall ( ) having a spaced apart relationship forming a gap ( ) therebetween. The inner wall ( ) closely receives the semiconductor wafers ( ). The containment device also includes a second housing member ( ) that is securably attachable to the first housing member ( ) and which has a frame ( ) that forms the top of the containment device when the first and second housing members ( ) are securably attached together. The first and second housing members are secured by a plurality of latches ( ), each with a hook ( ) secured to the first housing member which passes through a hole ( ) in the second housing member and is releasably secured within the hole by the hook. In accordance with a second embodiment of the invention, the latches and holes of the first embodiment are replaced with a plurality of rotatable latch members ( ) which are secured to the first housing member and are rotatable about a hinge ( ), each latch member ( ) having a hook ( ) at the distal end thereof for engagement with a hole ( ) in the second housing member. One of the walls ( ) of the first embodiment is removed and replaced with a liner of a very soft rubber or foam ( ), preferably of an antistatic variety, which will absorb shock applied to the housing.

A lightweight packing reel for storing encapsulated semiconductor devices which may be baked for extended periods of time at temperatures sufficiently high to desorb moisture from the packages, and which allows efficient flow of heat and air through the tape and reel assemblage is provided.

Lightweight, high temperature packing reel for integrated circuits

A containment device for retaining semiconductor wafers (,) is disclosed. The containment device comprises a first housing member (,) having a frame (,), an inner wall (,) and an outer wall (,). The inner wall (,) and outer wall (,) each extend generally perpendicularly from the frame (,). The inner wall (,) and outer wall (,) have a spaced apart relationship forming a gap (,) therebetween. The inner wall (,) closely receives the semiconductor wafers (,). The containment device also comprises a second housing member (,) that is securably attachable to the first housing member (,). The second housing member (,) has a frame (,) that forms the top of the containment device when the first and second housing members (,) are securably attached together.

A multifunctional shipping container for integrated circuits, and methods of using and reusing the container are described. The compact container coupled with foam inserts is dimensioned to securely ship and store integrated circuits in either tray or reel format. The container with an expandable cavity allows ease of access for loading and unloading the contents at multiple work stations, and may be converted to an in-house 'tote'. Multifunctionality of the container supports use as a shipping system from the tray or reel supplier, to the IC assembly and test site, to distribution centers, and to the IC customer, thus eliminating multiple costs of disposal, inventory and new shipping materials.

Growing community of inventors

Plano, TX, United States of America

Michael Louis Hayden