Siemens Aktiengesellschaft

Infineon Technologies Austria Ag

Valeo Siemens Eautomotive Germany Gmbh

Michael Leipenat

Waldemar Jakobi

Egbert Lamminger

Peter Luniewski

Stefan Völkel

Holger Hoffmann

Gunnar Dietz

Michael Fuegl

Harald Hofmann

Markus Neubert

Enrico Fuchs

Stefan Piepenbreier

Sandro Beyer

A semiconductor package includes a substrate including a die pad, first and second discrete transistor dies mounted on the die pad, an encapsulant body that encapsulates the first and second discrete transistor dies, and a plurality of leads that are exposed from the encapsulant body, wherein the first and second discrete transistor dies are connected in parallel with one another by electrical interconnections that electrically connect common terminals of the first and second discrete transistor dies to one of the leads, and wherein at least one of the electrical interconnections has a balanced configuration that provides substantially identical electrical impedance as between the common terminals of the first and second discrete transistor dies and the lead to which they are connected.

Semiconductor package with balanced impedance

A method for operating power semiconductors arranged in converters, includes measuring with a temperature sensor a temperature of at least one of the power semiconductors, performing a comparison of the temperature of the at least one power semiconductor with a reference temperature and providing a result of the comparison; activating a pre-heating phase for preheating the power semiconductors as a function of the result; during the pre-heating phase, defining a pre-heating current; and impressing the pre-heating current into an electrical load.

Method for operating power semiconductors

Growing community of inventors

Pommelsbrunn, Germany

Michael Leipenat