Qualcomm Incorporated

Hewlett-packard Development Company, L.P.

Michael Lehr

Manjirnath A Chatterjee

Dyke Shaffer

Mark Corbridge

Eric Hc Liu

Stuart K Neubarth

Wim Crooijmans

Allan Hessenflow

Jacob Rasco

A coil assembly is disclosed. The coil assembly includes a coil that is provided on a substrate. The coil includes a trace element that is wound on the substrate. The trace element includes an interior gap that extends or is present along at least a portion of the trace element. The interior gap is dimensioned to reduce a presence of eddy currents that would otherwise be generated when the coil is active to inductively transmit or receive signals.

Flat power coil for wireless charging applications

At least two devices are provided that can each form part of a system to inductively exchange power and data. One device is capable of inductively transmitting a power signal to a second device, and to receive feedback from the second device in order to regulate the power signal.

Inductive signal transfer system for computing devices

An inductive signal interface comprises a coil assembly including one or more inductive coils, a bridge circuit including a plurality of switches, and control circuitry. The control circuitry is configured to individually operate the plurality of switches to enable the inductive signal interface to dynamically switch between a power-transmit mode and a power receive mode.

Power bridge circuit for bi-directional inductive signaling

Embodiments described herein include a computing device that is capable of inductive signal transfer with other computing devices. Such computing devices are provided a shield that protects the device and other components from electromagnetic interference and unwanted electrical affects resulting from the inductive signal transfer.

Growing community of inventors

Sunnyvale, CA, United States of America

Michael Lehr