Macom Technology Solutions Holdings, Inc.

Infineon Technologies Ag

Cree Gmbh

Wolfspeed, Inc.

Michael Lefevre

Alexander Komposch

Bill Agar

Xikun Zhang

Dejiang Chang

Marvin Marbell

Basim H Noori

Haedong Jang

Richard Wilson

Qianli Mu

Jeremy Fisher

Jonathan Chang

A multi-die package includes a thermally conductive flange, a first semiconductor die made of a first semiconductor material attached to the thermally conductive flange via a first die attach material, a second semiconductor die attached to the same thermally conductive flange as the first semiconductor die via a second die attach material, and leads attached to the thermally conductive flange or to an insulating member secured to the flange. The leads are configured to provide external electrical access to the first and second semiconductor dies. The second semiconductor die is made of a second semiconductor material different than the first semiconductor material. Additional multi-die package embodiments are described.

Package with different types of semiconductor dies attached to a flange

A semiconductor device package includes a plurality of input leads and an output lead, a plurality of transistor amplifier dies having inputs respectively coupled to the plurality of input leads, and a combination circuit configured to combine output signals received from the plurality of transistor amplifier dies and output a combined signal to the output lead.

Output-integrated transistor amplifier device packages incorporating internal connections

An amplifier includes an input matching network; at least one transistor; an input lead coupled to the at least one transistor; a ground terminal coupled to the transistor; an output lead coupled to the at least one transistor; an output matching circuit coupled to the output lead and to the at least one transistor; and a baseband impedance enhancement circuit having at least one reactive element coupled to the input matching network. The baseband impedance enhancement circuit is configured to reduce resonances of a baseband termination.

Radio frequency amplifier implementing an input baseband enhancement circuit and a process of implementing the same

A multi-die package is manufactured by attaching a first semiconductor die made of a first semiconductor material to a thermally conductive flange via a first die attach material, and attaching a second semiconductor die to the same thermally conductive flange as the first semiconductor die via a second die attach material. The second semiconductor die is made of a second semiconductor material different than the first semiconductor material. The first semiconductor die is held in place by the first die attach material during attachment of the second semiconductor die to the flange. Leads are attached to the thermally conductive flange or to an insulating member secured to the flange. The leads provide external electrical access to the first and second semiconductor dies.

Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange

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Morgan Hill, CA, United States of America

Michael Lefevre