Rockley Photonics Limited

Michael Lee

Ying Luo

Vivek Raghunathan

Chia-Te Chou

Brett Sawyer

John Drake

Albert Benzoni

William Vis

Melissa Ziebell

A system and method for alignment. In some embodiments, the method includes measuring a first offset, the first offset being an offset along a first direction between a first alignment mark and a second alignment mark, the first alignment mark being an alignment mark on a first edge of a source die, the second alignment mark being an alignment mark on a target wafer, and the first direction being substantially parallel to the first edge of the source die.

System and method for measuring alignment

A silicon integrated circuit. In some embodiments, the silicon integrated circuit includes a first conductive trace, on a top surface of the silicon integrated circuit, a dielectric layer, on the first conductive trace, and a second conductive trace, on the dielectric layer, connected to the first conductive trace through a first via.

Silicon photonic interposer with two metal redistribution layers

Growing community of inventors

Los Angeles, CA, United States of America

Michael Lee