Avago Technologies International Sales Pte. Limited

Michael Leary

Chris Chung

Domingo Figueredo

Ah Ron Lee

Sarah Kay Haney

YongIk Choi

Li Sun

Chang Kyu Choi

Jeesu Kim

Dong Hoon Choi

Myung Soo Kang

Yonglk Choi

The subject technology is directed to systems and methods for integrating inductors within printed circuit boards. In an embodiment, the subject technology provides an apparatus that includes a substrate comprising a first layer and a first inductor coupled to the first layer. The first inductor includes a second layer comprising a first metal material and a third layer comprising a second metal material. The third layer is coupled to the second layer through a first interconnect. The first inductor may be embedded within the substrate to enable efficient space utilization, leading to overall miniaturization and improved performance due to shorter signal paths and reduced parasitic effects. There are other embodiments as well.

Systems and methods for integrating inductors within printed circuit boards

In some aspects, the disclosure is directed a module for improving mechanical, electrical, or thermal performance. In some embodiments, the module includes a bottom surface, a side surface, a first solder bump disposed on the bottom surface, and a second solder bump disposed on the bottom surface. In some embodiments, the bottom surface extends in a first lateral direction and a second lateral direction perpendicular to the first lateral direction. In some embodiments, the side surface extends in a vertical direction perpendicular to the first lateral direction and the second lateral direction. In some embodiments, the second solder bump is adjacent to the side surface. In some embodiments, the first solder bump has a first length in the first lateral direction. In some embodiments, the second solder bump has a second length in the first lateral direction. In some embodiments, the first length is greater than the second length.

Device having solder bump structure for improved mechanical, electrical, and/or thermal performance

A device and substrate are disclosed. An illustrative device includes a substrate having a first surface and an opposing second surface, a solder material receiving curved surface exposed at the second surface of the substrate, a solder resist material that at least partially covers the solder material receiving curved surface such that a middle portion of the solder receiving curved surface is exposed and such that an edge portion of the solder material receiving curved surface is covered by the solder resist material and forms an undercut, and a solder material disposed within the solder material receiving curved surface and within the undercut.

Substrate having undercut portion for stress mitigation

Structure for improved mechanical, electrical, and/or thermal performance having solder bumps with different lengths

A passive component includes a body including a dummy portion and a device portion. The dummy portion and the device portion extend in a first direction and are arranged such that a longitudinal axis of the device portion is offset from a longitudinal axis of the body in a second direction perpendicular to the first direction. The passive component further includes first and second electrical contacts on at least one surface of the body.

Low profile passive components and devices and packages including the same

Stress mitigation structure

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Sunnyvale, CA, United States of America

Michael Leary