Hewlett Packard Enterprise Development LP

Hewlett-packard Development Company, L.p.

Compaq Computer Corporation, Inc.

Nvidia Corporation

Michael Lawrence Sabotta

John P Franz

Tahir Cader

David Allen Moore

Thomas W Grieff

Bryan A Jones

Alan B Doerr

Michael S Bunker

Michael White

Sajid A Momin

Kevin B Leigh

Elad Mentovich

Ryan Donovan Wells

Melvin K Benedict

Balaji Natrajan

Eitan Zahavi

Patrick A Raymond

Paul A Santeler

Brian T Purcell

Reza Mushtag Bacchus

David M Paquin

Siddha Ganju

John D Nguyen

Jeffery Michael Giardina

Susheela N Narasimhan

Purna C Murthy

Albert H Chang

Lawrence W Lomelino

Larry E Wilson

Herman W Chu

M Scott Bunker

Reza Azizian

Michael Norman

Charles R Hanna

Michael Balint

Glenn H Lupton

Suzie Mkandawire

Henry F Lada

David Moore

A method includes receiving, using a processing device, a first condition associated with an operation at a data center, where the operation at the data center pertains to a first location at the data center, the first location corresponding to a first parameter value. The method further includes providing the first condition as an input to a machine learning model. The method also includes performing one or more reinforcement learning techniques using the machine learning model to cause the machine learning model to output an indication of a final location associated with the operation, where the final location corresponds to a final parameter value that is closer to a target than the first parameter value corresponding to the first location at the data center.

Data center job scheduling using machine learning

Apparatuses, systems, and techniques to cool computer processors. In at least one embodiment, a system comprises one or more processors and a heatsink connected by a flexible heat conduit to the one or more processors, and a position of the heatsink is adjustable.

Configurable heatsink

An assembly useable with a cooling system is provided herein. The assembly includes a support member, a channel, and a fluid control mechanism. The support member includes a receiving member formed therein to receive a thermal member. The channel is formed within the support member to carry a fluid therethrough. The fluid control mechanism is along the channel to control the flow of the fluid.

Cooling assembly

The present disclosure discloses an expansion bus device that is communicatively coupled to a plurality of input-output devices. The expansion bus device includes a plurality of input-output slots, via which the plurality of input-output devices are coupled to the expansion bus device. The expansion bus device also includes a retimer switch communicatively connected to each of the plurality of input-output slots. The retimer switch supports switching between the plurality of input-output slots.

Expansion bus devices comprising retimer switches

An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

Liquid cooling

Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.

Heat dissipating system

An assembly for liquid cooling is provided herein. The assembly includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

In one implementation of a modular rack system, a rack module () comprises a bay () comprising a first side wall (), a second side wall () and floor () and an intermediate wall positioning mechanism () to support a wall () at different spacings with respect to the first side wall (). In another implementation of the modular rack system, a utility bay () extends across rack modules ().

Modular rack system

An assembly to connect two electronic components is provided herein. The assembly includes a lever unit with a lever and a base. The lever includes a primary cam member and a secondary cam member connected thereto. The lever also includes a hook member extending therefrom. The base includes a guide structure to engage with a drive pin. Rotation of the lever to move a first electronic component along a y-axis towards, a backplane. The secondary cam member to move the drive pin along the guide structure, and the hook member to engage with a second electronic component and mate the first electronic component and the second electronic component along the second axis.

Lever unit

An example of a server rack lifting apparatus can include a first side portion, a second side portion opposing the first side portion, a back portion connecting the first side portion to the second side portion, a first lifting surface associated with the first side portion to engage a portion of a server rack, a second lifting surface associated with the second side portion to engage an opposing portion of the server rack, and a motive component to adjust a height of the first and second lifting surfaces.

Server rack lift

Examples of the present disclosure may include methods and systems for liquid temperature control cooling. An example of a liquid temperature control cooling system for an electronics rack () can include a number of electronic devices () in the electronics rack (), a panel (-----) that extends from a roof () to a floor () inside the electronics rack (), where a face of the panel (-----) is parallel to a direction in which the number of electronic devices () slide into the electronics rack () and perpendicular to a front of the electronics rack, and a heat receiving structure () that is integrated into the panel (-----) and that is thermally coupled to the number of electronic devices () through the panel (-----), where the heat receiving structure () can include a liquid flow compartment () an input () to receive cool liquid into the liquid flow compartment (), and a control valve (----) to release warm liquid from the liquid flow compartment ().

Liquid temperature control cooling

A thermally actuated valve is provided herein. The thermally actuated valve includes a valve fitting, a valve body, and a movement control mechanism. The valve fitting includes an active member to selectively activate based on an input. The valve body includes a passive wax member that moves between a passive contraction state and a passive expansion state based on a passive temperature. The movement control mechanism is disposed between the valve fitting and the valve body. The movement control mechanism controls movement of the valve body between an open state and a dosed state based on movement of at least one of the active member and the passive wax member.

Thermally actuated valve

A chassis comprises a printed circuit board (PCB) and a sub-chassis housing multiple processors that couple to the PCB. The sub-chassis is disposed above and parallel to the PCB. The multiple processors are cooled by a fan disposed on the sub-chassis.

Fan for cooling multiple processors housed in a sub-chassis

Growing community of inventors

Houston, TX, United States of America

Michael Lawrence Sabotta