Infineon Technologies Ag

Michael Larisch

Oskar Neuhoff

Norbert Martin Haueis

Dirk Pikorz

Tobias Gamon

Ulrich Beck

Franz Reithner

Michael Walser

Thomas Fischer

Raimund Foerg

Christoph Koch

Sven Schennetten

Sebastian Bernrieder

Rene Cordes

An adapter tool configured to be attached to a loadport of a wafer handling system includes a support member and first and second guiding elements attached to the support member and being juxtaposed to each other. The first guiding element is arranged for placing a first wafer magazine, and the second guiding element is arranged for placing a second wafer magazine. The adapter tool further includes a housing supported by the support member and configured to house the first and the second wafer magazines, respectively, and first and second openings in the housing, respectively. The first and second openings are aligned with the first and second guiding elements.

Adapter tool configured to be attached to a loadport of a wafer handling system and wafer handling system with such an adapter tool

One aspect of the invention relates to a semiconductor module with an outer housing having four side walls, and a circuit carrier, which is mounted on the outer housing and has an upper side and a lower side opposite the upper side. A semiconductor chip is arranged on the upper side and in the outer housing. A first gripping socket, which is formed as an indentation, extends from the outer side of the outer housing into a first of the side walls.

Semiconductor module with gripping sockets, methods for gripping, for moving and for electrically testing a semiconductor module

An adapter tool that is configured to be attached to a loadport of a wafer handling system includes a support member, and first and second guiding elements supported by the support member. The first and second guiding elements are arranged for placing a first wafer magazine and a second wafer magazine, respectively. The adapter tool further includes a housing supported by the support member that is configured to house the first and the second wafer magazines, respectively, and first and second openings in the housing, respectively. The first and second openings are aligned with the first and second guiding elements.

Adapter tool and wafer handling system

A system produces devices that include a semiconductor part and a non-semiconductor part. A front end is configured to receive a semiconductor part and to process the semiconductor part. A back end is configured to receive the processed semiconductor part and to assemble the processed semiconductor part and a non-semiconductor part into a device. A transfer device is configured to automatically handle the semiconductor part in the front end and to automatically transfer the processed semiconductor part to the back end.

System and method for producing devices including a semiconductor part and a non-semiconductor part

An etching device is provided, the etching device including a process chamber including an etchant, a structure configured to provide a laminar flow of the etchant, and a workpiece handler configured to move a workpiece through the laminar flow of the etchant along a predefined track.

Etching device and a method for etching a material of a workpiece

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Wuppertal, Germany

Michael Larisch