Oerlikon Trading Ag, Trubbach

Michael Lanker

Claus Heine-Kempkens

Max Wiki

Philipp Smole

This invention concerns a method of producing subsurface marking in a transparent body. According to the invention, the marking is done less than 500 &#x3bc;m below the surface by applying a layer system with a high destruction threshold, compared to the substrate, to the surface of the substrate. If the layer system is designed as an anti-reflection coating system for the reading wavelength, it increases the contrast for reading. If the layer system is designed as a mirror for the writing wavelength, the writing can be done in reflection at a lower intensity.

Transparent substrates with dielectric layer having a marking below the surface of the transparent substrate

A mask for photolithography methods comprises opaque and transparent areas as well as a surface structure. For the contact with a substrate () to be exposed at least a few opaque areas are incorporated and at least a few transparent areas are arranged in a spaced fashion and are deep-etched down to a structural depth. In a further embodiment at least one transparent area is designed as a positively resting area (). The structural depth in the deep-etched areas is greater than the thickness of the surface structure, at least greater than or equal to 1 &#x3bc;m.

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Pfaffikon, Switzerland

Michael Lanker