Siemens Aktiengesellschaft

Michael Langenwalter

Detlef Haberland

Lothar Spaeter

Werner Spaeth

Klaus Panzer

Herbert Prussas

Helmut Haltenorth

Jan Smola

Karl H Moehrmann

Bernd Seibert

Lothar Spater

Hans G Rosen

An optoelectronic module is disclosed comprising an optoelectronic component (D), e.g. a photodiode (D) and/or a laser diode (D); a ring (RI) as an optical aperture in a wall of its housing (S/E/P, S/G/W) for the transmission of information-modulated light to or from the component (D) through the housing wall (S) to or from an optical component (L); and a lens system (K) having at least one lens (K), among them, at least one focusing lens (K) encircled by the ring (RI) or at least by a section of the ring (RI). At least one of the lenses (K) consists of glass and is intergrown with the ring (RI), at least in part consisting of glass, so as to be hermetically tight all around forming an intergrowth zone (SZ). Furthermore, the ring (RI) is inserted in the housing wall so as to form a hermetically tight seal.

Optoelectronic module

In an opto-electronic module housing for positioning an end of an optical fiber in a desired position relative to an active area of an opto-electronic component characterized by the housing including an optical fiber connector having an adjustment plane at one end and an arrangement for holding an end of an optical fiber with the axis of the fiber on an axis extending perpendicular to the adjustment plane with the end being a fixed distance from the plane, an adjustment frame being securable to the adjustment plane and an arrangement for locating an opto-electronic component or transducer relative to the frame including a plate having the component mounted thereon. The arrangement including the plate is securable to the frame and the frame and the arrangement enable adjusting the component in three spatial directions relative to the end of the fiber to obtain an optimum adjustable position. The module housing can be received in an outer gas and light-tight housing in which case the connector extends through a wall of a can or member forming part of the outer housing which coacts with a lid to enable access to the interiorly disposed module housing. The component can either be a light-emitting opto-electronic component or a light-opto-electronic receiving component.

Opto-electronic module housing

A common housing for two semi-conductor bodies is provided, comprising a front and back section for two spatially separate semi-conductor bodies attached in the housing interior but preferably connected in electrically conductive fashion to one another, whereby the housing surface preferably composed entirely of metal is cooled during operation by a flowable coolant, preferably cooling air. The front, first semi-conductor body is attached in the front section thereof and the back, second semi-conductor body is attached in the back section thereof, the maximum operating temperature of the back semi-conductor body being higher than the maximum operating temperature of the front semi-conductor body, at least at times. The thermal resistance between the front semi-conductor body and a front thermally conductive cooling surface as well as the thermal resistance between the back semi-conductor body and a back thermally conductive cooling surface differing from the front cooling surface, being respectively lower than both the thermal resistance in the housing interior between the two semi-conductor bodies as well as the thermal resistance between the front and the back cooling surface. During operation, the coolant first flows past the front cooling surface and subsequently flows past the back cooling surface.

Common housing for two semi-conductor bodies

An optoelectronic transducer for the conversion of lightwaves to electrical voltage or current, or of voltage or current to lightwaves is disclosed, the transducer comprising a fiber optical system (K, L), a support (T) on which an optoelectronic structural element (D) with at least first and second electric leads (E1/D1, E2/D2/DD) is fastened, and a hole (LO) through the support (T) so arranged that the optically active point of the structural element (D) is directed onto the fiber optical system (K, L) across the hole (LO), the hole wall having a metallic coating (DD) which in operation constitutes a section of the first lead of the structural element (D), the first lead capable of sustaining high speed data transmission.

Optoelectronic transducer

Growing community of inventors

Stockdorf, Germany

Michael Langenwalter