Intel Corporation

Michael L Rutigliano

Michael R Stark

Peter A Davison

Bill Lieska

James S Webb

Daryl James Nelson

Todd R Coons

Christopher Wade Ackerman

Ioan Sauciuc

James G Maveety

Ashish Gupta

Ravi V Mahajan

Robert Starkston

Joe F Walczyk

Yoke Dou Chung

Charles A Gealer

Abram M Detofsky

James C Shipley

Tolga Acikalin

Christopher Roy Schroeder

Mark Edward Thurston

Raymond A Krick

John A Rabenius

Scot W Taylor

Farukh Fares

Lee Topic

Edmond L Hart

David Alan Brown

David Shia

Edvin Cetegen

Kuang C Liu

Kelly P Lofgreen

Joseph B Petrini

Eric J M Moret

William Wong

Yang Jiao

Amol Kirtikar

Embodiments described herein may be related to apparatuses, processes, and techniques related to incorporating photonics integrated circuitry into a base die, the base die including an optical interconnect at a bottom of the base die to transmit and to receive light signals from outside the base die. The top of the base die includes one or more electrical connectors that are electrically coupled with the photonics integrated circuitry. The base die may be referred to as the photonics die. A system-on-a-chip (SOC) may be electrically coupled with and stacked onto the top of the photonics die. Other embodiments may be described and/or claimed.

Stackable photonics die with direct optical interconnect

Embodiments described herein may be related to apparatuses, processes, and techniques related to active optical plugs used to cover optical connectors of a photonics package to protect the connectors. The active optical plugs may also be used to perform testing of the photonics package, including generating light to be sent to the photonics package and to detect light received from the photonics package as part of the test protocol. This allows testing the optical connection and the photonics package, without exposing the optical connections of the package to damage from dust or physical contact. Other embodiments may be described and/or claimed.

Active optical plug to optically or electrically test a photonics package

A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.

Conformable heat sink interface with a high thermal conductivity

An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same

Devices and methods useful for testing bare and packaged semiconductor dice are provided. As integrated circuit chips become smaller and increasingly complex, the interface presented by a chip for connectivity with power supplies and other components of the system into which it is integrated similarly becomes smaller and more complex. Embodiments of the invention provide micron-scale accuracy alignment capabilities for fine pitch device first level interconnect areas. Embodiments of the invention employ air-bearings to effectuate the movement and alignment of a device under test with a testing interface. Additionally, testing interfaces comprising membranes supported by thermal fluids are provided.

Positioning and socketing for semiconductor dice

An emblem that is located within a recess of a cover. The cover may be part of a cartridge which also contains a number of integrated circuit packages that are mounted to a printed circuit board. The emblem is typically attached to the cover by an adhesive. The recess reduces the likelihood of the emblem being removed from the cover. The emblem preferably contains a hologram which can identify a type of cartridge produced by a manufacturer.

Injection mold gate concealment by integrating surface recess and cosmetic label attachment

A shield for an electronic cartridge which has a pin that attaches a thermal element to a substrate. One edge of the substrate may have a plurality of conductive pads. The shield may have a base located adjacent to the conductive pads. The shield may include an arm which extends from the base and a finger which extends from the arm. The shield can be installed by sliding the arm toward the thermal element so that the pin engages and deflects the finger. The shield is moved toward the thermal element until the pin snaps into a notch located at the end of the finger. The finger may exert a spring force which pushes the base into the thermal element and secures the shield to the cartridge.

Protection shield for an electronic cartridge

A retention mechanism which may include a pair of flexible tabs. The flexible tabs may be pressed into opposing side edges of a substrate which supports an integrated circuit package. The substrate may be part of an electronic cartridge which has a cover. The flexible tab may extend through a space between the substrate and the cover such that the retention mechanism has a profile that is no greater than the cartridge. The retention mechanism may be mounted to a motherboard. The motherboard may have a connector that receives the substrate. An insertion tool can be used to plug the cartridge into the connector and couple the flexible tab to the substrate. An extraction tool can be used to pull the cartridge out of the connector and separate the substrate from the flexible tabs.

Inboard retention system for processor enclosure assemblies with substrate alignment

An electronic cartridge that includes a pair of spring clips which attach a thermal element to an integrated circuit or an integrated circuit package. The integrated circuit/package is mounted to a substrate. The substrate may be a printed circuit board. The cartridge may have a plurality of pins that extend from the thermal element and through the substrate. Each spring clip may have a pair of bent portions that are attached to the pins of the thermal element. The spring clip exerts a pull force that pulls the thermal element into the integrated circuit/package. The bent ports can be deflected so that at least a minimum pull force is always exerted onto the thermal element even with dimensional variations in the parts of the cartridge. The bent portions can therefore accommodate for tolerances in the cartridge while clamping the thermal element to the integrated circuit/package.

Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges

An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a &ldquo;shield&rdquo; about the integrated circuit package so that any electromagnetic field that flows from the package is grounded to the substrate.

EMI containment for microprocessor core mounted on a card using surface mounted clips

A simplified method and apparatus for creating counterfeit-resistant labels is described. A laser is used to mark a retro-reflective material such that light only from specific directions are reflected back towards the source. During authentication of the labels, the label is tilted to verify that only light from the specific directions are reflected back towards the source.

Laser marking process on retro-reflective material for security labels

An electronic cartridge which may include an integrated circuit package that is mounted to a substrate. The substrate may include a plurality of conductive pads that are inserted into an electrical connector. The cartridge may be guided into the connector by a guide rail which has a latch slot. The electronic cartridge may include a latch which extends from a cover that is coupled to the substrate. The latch may extend into the latch slot to secure the cartridge to the connector.

Mechanical latch for an electronic cartridge

An electronic cartridge which includes a cover. The cover is coupled to a substrate which has an integrated circuit package. A portion of the cover extends over and is spaced from a plurality of conductive pads located along an edge of the substrate. The conductive pads can be inserted into a card edge electrical connector that is mounted to a motherboard. The cover of the present invention protects the conductive pads while allowing the substrate to be plugged into a card edge connector.

Intergrated processor substrate protective enclosure for use in desktop

An electrical connector for establishing an interconnection between the contact pads of a printed circuit board and an electrical device. The connector includes a flexible circuit that is capable of being electrically coupled to a tester, driver, or some other external electrical device. The flexible circuit has a first side and an opposite second side and includes at least one metal layer and a plurality of electrically conductive contact bumps that are attached to and protrude from the metal layer along the first side. An expandable bladder is positioned adjacent the flexible circuit and exerts a force against the second side of the flexible circuit to cause the contact bumps to physically engage with the contact pads of the printed circuit board. A gas cylinder, pump, air compressor or other fluid pressure source is operatively coupled to the bladder for causing expansion of the bladder to effect the engagement of the contact bumps of the flexible circuit with the contact pads of the printed circuit board.

Growing community of inventors

Chandler, AZ, United States of America

Michael L Rutigliano