International Business Machines Corporation

Michael L Passow

Eli M Dow

James Anthony O'Neill

Jyothi Singh

Harry Roger Kolar

Richard Anthony Conti

Michael D Armacost

William Francis Landers

Jonathan Daniel Chapple-Sokol

Michael James Kelly

Karl E Boggs

William C Wille

Kenneth M Davis

Tina J Cotler

Dominic Joseph Schepis

David M Dobuzinsky

Yiheng Xu

Jeremy K Stephens

Matthew J Sendelbach

Willard E Conley

Tina Jane Wagner

Adam D Ticknor

Waldemar Walter Kocon

Ronald Anthony DellaGuardia

David Angell

Stuart M Burns

Gary R Moore

Michael R Kelly

Robert M Merkling, Jr

Joseph Byrne

Harry D Clark

Tina J Cotler-Wagner

A system for mapping a thermocline in a body of fluid includes a thermocline detection and monitoring module, a persistent data storage module; and a plurality of distributed sensors, including intelligent sensors, connected with the at least one thermocline detection and monitoring module and the persistent data storage module by one or more control-level programming and communication methods. The thennocline detection and monitoring module can monitor the thermocline at sampling intervals to collect and fuse measurement data from the plurality of sensors to capture thermocline changes as events, correlate measurement data and events, store measurement data in the persistent data storage module along with previously acquired measurement data for comparison and tracking, characterize the thermocline as a function of spatial location, depth, and time, create and maintain reports that describe the thermocline characteristics, status, trends, and provide multimodal notifications of events to different users.

Intelligent/autonomous thermocline mapping and monitoring for marine and freshwater applications

An aspect of the disclosure includes a method, a system and a computer program product. The method includes measuring a first data with a sensor, the sensor and operatively coupled computing resources having at least two power states, an operating power state and a low power state, the low power state consuming less energy than the operating power state. A first time period is determined for measuring a second data, the first time period being based at least in part on the first data. The sensor is operated, and operatively coupled computing resources at the low power state during the first time period, wherein no data measurements are acquired during the first time period. The sensor is changed to the operating power state at an expiration of the first time period.

Dynamic time sliced sensor sampling for reduced power consumption

A computer-implemented method includes arranging two or more sensor nodes into a ring monitor. Each sensor node of the ring monitor is coupled to a sensor and cross-monitors at least one other sensor node in the ring monitor. A request is received to add a new sensor node. A spatial partitioning of a plane is generated, by a computer processor, representing locations of the new sensor node and the two or more sensor nodes in the ring monitor. The spatial partitioning includes a plurality of regions, each region corresponding to a sensor node. Two or more adjacent sensor nodes are selected from the two or more sensor nodes in the ring monitor, based at least in part on the spatial partitioning. The two or more adjacent sensor nodes are instructed to monitor the new sensor node, which is instructed to monitor each of the two or more adjacent sensor nodes.

Ring-based monitoring of sensor mesh networks

A real time alarm classification system and method of use and, more particularly, to a residual gas analyzer configured to identify specific root causes of an abnormal condition such as, for example, contamination, undesirable process variability and equipment malfunction in wafer processing. The real-time alarm classification system comprises a computer infrastructure operable to: generate top contributors associated with an alarm triggered by sensed abnormal conditions; compare the top contributors to contributors of historic RGA (residual gas analyzer) alarms of known root causes that were generated by a validated model; and provide a probable root cause of the sensed abnormal conditions when a match is found between the top contributors and the contributors associated with the historic RGA alarms of known root causes. A method and computer readable medium is also contemplated to provide the processes.

Real time alarm classification and method of use

An in-situ method for regenerating a chemical-mechanical polishing pad which includes the steps of: forming the polishing pad by dispensing liquid moldable material, such as wax, polymers or water, on a polishing surface and solidifying the liquid material by reducing the temperature, allowing the moldable material to harden; distributing slurry material on the polishing pad; polishing the surface of a semiconductor wafer with a combination of the slurry material and the polishing pad; and regenerating in-situ the polishing pad. This method quickly, easily and repeatably, resurfaces and refreshes the surface on which the a semiconductor wafer is polished. The polishing pad may also include abrasives embedded therein to enhance its polishing capabilities.

Regeneration of chemical mechanical polishing pads in-situ

A process for estimating a critical dimension of a trench formed by etching a substrate. First, a regression model is constructed for estimating the critical dimension, in which principal component loadings and principal component scores are also calculated. Next, a substrate is etched and spectral data of the etching are collected. A new principal component score is then calculated using the spectral data and the principal component loadings. Finally, the critical dimension of the trench is estimated by applying the new principal component score to the regression model.

Reactive ion etch loading measurement technique

A resist formulation minimizes blistering during reactive ion etching processes resulting in an increased amount of polymer by-product deposition. Such processes involve exciting a gaseous fluorocarbon etchant with sufficient energy to form a high-density plasma, and the use of an etchant having a carbon-to-fluorine ratio of at least 0.33. In addition to a conventional photoactive component, resists which minimize blistering under these conditions include a resin binder which is a terpolymer having: (a) units that contain acid-labile groups; (b) units that are free of reactive groups and hydroxyl groups; and (c) units that contribute to aqueous developability of the photoresist. After the photoresist is patterned on the silicon oxide layer and the high-density plasma is formed, the high-density plasma is introduced to the silicon oxide layer to etch at least one opening in the silicon oxide layer. Preferably, the terpolymer is made up of about 70% 4-hydroxystyrene, about 20% styrene, and about 10% t-butylacrylate.

Resist formulation which minimizes blistering during etching

A system for polishing a surface. The surface is positioned in contact with a rotating table having a polishing slurry or compound applied to a table surface. The pattern formed in the polishing compound as the table is rotated is monitored, and when the pattern dimensions reach a predetermined size, indicating a polished end point, the polisher ends polishing.

Apparatus and method for controlling polishing of integrated circuit

A dry etching process for etching an oxide layer on a substrate in which a plasma is created in a gaseous mixture containing C.sub.4 F.sub.8 and C.sub.2 F.sub.6. The dry etch process is useful for etching an oxide layer stopping on a silicon nitride layer on a semiconductor wafer of an integrated circuit structure as it eliminates resist blistering without sacrificing high selectivity to nitride, via wall angle, and/or etch uniformity.

Process of etching an oxide layer

An apparatus for processing a layer on a workpiece includes a source of reactant fluid, a reaction chamber having a support for the workpiece and a fluid delivery apparatus for feeding an input fluid into the reaction chamber with the input fluid being utilized to process the material. An infrared sensor is adapted to cooperate with the fluid delivery apparatus for sensing the concentration of a component of the input fluid. The infrared sensor includes an infrared light source positioned to direct a beam of infrared light at an infrared light detector through the input fluid. The infrared light detector produces an electrical output signal indicative of the amount of light received by the detector and therefore not absorbed by the input fluid.

Fluid delivery apparatus having an infrared feedline sensor

Fluid delivery apparatus and method having an infrared feedline sensor

An apparatus and method for determining the time at which a plasma etching process should be terminated. The process generates at least one etch product species and a continuum plasma emission. The apparatus monitors the optical emission intensity of the plasma in a narrow band centered about a predetermined spectral line and generates a first signal indicative of the spectral intensity of the etch product species. The apparatus further monitors the optical emission intensity of the plasma in a wide band and generates a second signal indicative of the spectral intensity of the continuum plasma emission. The apparatus further monitors the magnitudes of the first and second signals and generates a termination signal when the magnitudes diverge.

Method and apparatus for optical emission end point detection in plasma

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West Hurley, NY, United States of America

Michael L Passow