Rutgers, the State University of New Jersey

Other

Michael L Bushnell

Rajesh Ramadoss

Vishwani D Agrawal

Deepak Kumar Mehta

Xinghao Chen

Marwan A Gharaybeh

Baozhen Yu

Omar Khan

Lan Rao

Imtiaz Shaik

Raghuveer Ausoori

Ganapathy Parthasarathy

Design for testability (DFT) algorithms, which use both gradient descent and linear programming (LP) algorithms to insert test points (TPs) and/or scanned flip-flops (SFFs) into large circuits to make them testable are described. Scanning of either all flip-flops or a subset of flip-flops is supported. The algorithms measure testability using probabilities computed from logic simulation, Shannon's entropy measure (from information theory), and spectral analysis of the circuit in the frequency domain. The DFT hardware inserter methods uses toggling rates of the flip-flops (analyzed using digital signal processing (DSP) methods) and Shannon entropy measures of flip-flops to select flip-flops for scan. The optimal insertion of the DFT hardware reduces the amount of DFT hardware, since the gradient descent and linear program optimizations trade off inserting a TP versus inserting an SFF. The linear programs find the optimal solution to the optimization, and the entropy measures are used to maximize information flow through the circuit-under-test (CUT). The methods limit the amount of additional circuit hardware for test points and scan flip-flops.

Spectral and information theoretic method of test point, partial-scan, and full-scan flip-flop insertion to improve integrated circuit testability

The present invention relates to a novel active leakage power reduction technique, referred to as the dynamic power cutoff technique (DPCT). The DPCT method of the present invention can reduce active leakage, standby leakage, and dynamic power by applying the dynamic power cutoff technique to a circuit. In the method and system for dynamic power cutoff for active leakage reduction in circuits of the present invention, a switching window is determined for each gate, during which a gate makes its transitions. For example, the switching window can be determined by static timing analysis. Then, the circuit is optimally partitioned into different groups based on the minimal switching window (MSW) of each gate. Finally, power cutoff transistors are inserted into each group to control the power connections of that group. Each group is turned on only long enough for a wavefront of changing signals to propagate through that group. Since each gate is only turned on during a small timing window within each clock cycle, this significantly reduces active leakage power.

Method and system of dynamic power cutoff for active leakage reduction in circuits

The present invention relates to a method and system for detecting defects within an integrated circuit in which one or more parameters of a classifier are determined by graphical evaluation of IDDQ current measurements. Parameters of the classifier can include a number of bands for a good integrated circuit, a width of a band for a good chip, a width ratio between any two bands for a good integrated circuit, a separation between bands for a good integrated circuit, a separation ratio between any two bands for a good integrated circuit, a maximum slope for a good band, a variation in a band width for a good band, a maximum IDDQ value for a chip, a minimum IDDQ value for a chip, a mean of a band of a chip, a standard deviation of a band of a chip, a lack of activity of IDDQ measurements conducted in the integrated circuit, noise in the IDDQ measurements conducted in the integrated circuit and glitches in the IDDQ measurements conducted in the integrated circuit. The parameters can be customized for the integrated circuit under test. The method and system can be used with all types of digital CMOS integrated circuits including integrated circuits with or without memories and deep submicron integrated circuits with or without memories.

Method and system for graphical evaluation of IDDQ measurements

The present invention relates to a method and apparatus for testing analog and mixed analog and digital circuits in which test waveforms are generated for testing the analog circuit. The analog circuit can be represented by a directed circuit graph. The directed circuit graph represents nodes of components of the circuit under test connected by directed edges for components having inputs or outputs which effect other components and undirected edges for components in the circuit that are bidirectional. For example, undirected edges are assigned to bidirectional elements such as resistors and capacitors and directed edges are assigned to transistors. The directed graph is partitioned into partitions that carry a signal from the primary inputs toward the primary outputs in the circuit under test. Feedback and local feedback are captured in a single partition. The partition of a faulty component is determined and the operating point of the partition is established to activate the fault. The fault effects on the transfer function of each partition are determined by fault sensitization and fault effect propagation.

Test generation for analog circuits using partitioning and inverted system simulation

This invention relates to a method and apparatus for combined stuck-fault testing and partial scan delay-fault built-in self testing (BIST). For partial scan delay-fault BIST, the circuit is modeled for breaking all flip-flop feedback cycles in the circuit. A selection of flip-flops to be scanned to break all sequential cycles is determined from an optimal feedback vertex set. A digest, devour and tidy-up (DDT) heuristic can be used on a weighted signed graph formed from an S-graph of the circuit to determine an optimal feedback vertex set. Determined partial scan delay fault BIST hazards can be removed from the circuit by inserting parity flippers to invert selected paths during testing. The same DDT heuristic can be used to determine optimal placement of the parity flippers in the circuit.

Method and apparatus for combined stuck-at fault and partial-scanned delay-fault built-in self test

The present invention relates to a method and system for identifying tested path-delay faults in integrated circuits. A path status graph is generated to represent the detected status of simulated path-delay faults. The path status graph includes vertices representing primary inputs, primary outputs and elements of the circuit. Detected status path-delay faults can be dynamically distributed to edges of the path status graph. Tested path-delay faults can be identified from traversal of the edges of the path status graph.

Method and system for identifying tested path delay faults

The present invention relates to a method and apparatus for generating test patterns to test an analog or mixed signal circuit. A signal flow graph of the analog circuit is determined. The signal flow graph is inverted and reverse simulated with good and bad outputs to determine component tolerances of the circuit given circuit output tolerances. The inverted signal flow graph is backtraced from analog outputs to obtain analog input sinusoids which justify the analog outputs.

Test generation using signal flow graphs

This invention relates to a method and apparatus for robust delay fault testing of integrated circuits (IC) with built-in self-testing. For the method, hazardous nodes of the IC are determined. Thereafter, the topology of the IC can be modified to include a cut-point at hazardous nodes of the circuit. Input of the IC to the cut-point is diverted to an observation point. An out-put multi-input signature register (MISR) at the observation point generates a first signature. An output MISR provides a second signature for outputs to the IC. During testing, a hazard-free input pattern is applied to the IC and the generated first and second signatures are compared to known correct signatures.

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Princeton Junction, NJ, United States of America

Michael L Bushnell