Sauer Gmbh

Lasertec Gmbh

Sauer Gmbh Lasertec

Other

Maho Aktiengesellschaft

Michael Kuhl

Peter Hildebrand

Martin Reisacher

Peter Wrba

Karl-Hermann Richter

Gunter Eberl

Gottfried Reinicke

Udo Stürmer

Alfred Zwick

Alfons Eiterer

In a method for machining a workpiece, a laser beam () is guided across the workpiece surface by means of a beam guide (), wherein the laser beam guide comprises a first guide () effecting a laser beam guide at a first path speed. The laser beam guide comprises a second guide () simultaneously operating with the first guide, which effects a laser beam guide at a second path speed, which is higher than the first path speed.

Method and device for machining a workpiece

The invention relates to a method for producing a swaging in a workpiece, wherein a laser beam is guided through a beam guide over the surface of the workpiece in order to produce said swaging. The focal position of the laser beam is controlled in such a way that it can be varied at least temporarily in depth direction of the swaging. A device for the production of a swaging () in a workpiece () has a laser light source () for producing a laser beam for removing material, a focus adjustment device () for adjusting the focal position of the laser beam, a beam guide () for guiding the laser beam () over the surface of the workpiece and a control device () for controlling the focus adjustment device () and the beam guide (). The control device is designed to control the focal position of the laser beam by means of the focus adjustment device () at least temporarily to variable values in depth direction of the swaging.

Method and device for the production of a swaging

The invention relates to a method for machining a workpiece by means of a laser beam, wherein a laser beam is guided by a beam guiding device over the surface of the workpiece within a working window. The beam guiding device and the workpiece are arranged in such a way that they are movable relative to one another in a direction of displacement along a displacement section and that they can occupy a first and a second relative working position to one another. According to the invention, a point on the workpiece can be machined from the second relative working position, said point being located behind the point which is machined from the first relative working position when viewed in the direction of displacement.

Disclosed is a laser machining apparatus comprising a workpiece fixture for fastening a workpiece, a first laser removing device for machining a workpiece using first operating parameters, and a second laser removing device which can machine a workpiece using second operating parameters that are different from the first operating parameters, especially regarding the quality and quantity.

Laser machining apparatus and laser machining method

During the production of a swage in a workpiece in which material is removed in layers by means of a laser beam the side walls of the swage are processed by means of a laser beam and/or a processing means and/or ultrasonic waves.

Method and device for producing a cavity in a workpiece

According to a method for a depth measurement the depths of measuring points on a calibration surface are measured and correction values depending on differences between the measured values and known values are used and stored for a later correction. According to a method for the layer-wise production of a hollow the horizontal boundaries (x, y) for the removal of a layer (S) depending on the hollow depth (z) were determined from the shape definition of the hollow. The measured values can be continuously stored and used for a later control of the laser processing device.

Depth measurement and depth control or automatic depth control for a hollow to be produced by a laser processing device

A method of removing substance from the surface of a workpiece in which the removal of substance is effected layer-wise by irradiating a working site on the workpiece surface with a laser beam from a working head, the layer-wise removal of substance being carried out with the aid of a laser guidance guiding the laser across the surface of the workpiece within a working area predetermined by the apparatus, comprises positioning steps in which, after the start of the substance removal, the relative position of the workpiece and the working head are changed in accordance with a first and/or second criterion and adjusted so that a boundary of the working area comes to be disposed on different sections of the workpiece surface for identical working sites.

Method and apparatus for removing substance from the surface of a workpiece

The invention relates to a method of producing an aperture in a metallic component, in which the aperture comprises, at least in certain portions, a non-cylindrically formed funnel, extends from a first surface to a second surface of a component wall and is formed by a laser beam. The invention improves the dimensional accuracy and reduces the roughness of the surface of the aperture and/or funnel in that, by appropriate choice of the laser parameters, the metal is predominantly removed by sublimation during the formation of the funnel and the funnel is formed by laser removal of layers of a substantially constant thickness.

Method for producing an opening in a metallic structural part

A process for precision control of a laser beam for machining workpieces while achieving high surface quality. The actual distance between a reference location and the workpiece surface is determined. A setpoint/actual value deviation between a predetermined setpoint distance and the actual distance measured is also determined. Control parameters are determined by a control unit in accordance with the setpoint/actual value deviation. The resulting control parameter outputs are coupled to a laser control unit to control the beam power of the laser. The disclosure also includes the apparatus for accomplishing the process.

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Füssen, Germany

Michael Kuhl