Biotronik Crm Patent Ag

Michael Krenkel

Dieter Schwanke

Christian Zeilmann

An LTCC substrate structure with at least one contact element for connecting a wire conductor, which has a first metallization () arranged on and/or in the ceramic substrate for electrical connection to the wire conductor, wherein the first metallization () preferably contains silver or a silver alloy. To avoid via posting or a plating process, a diffusion barrier layer covering the first metallization or metal layer, which diffusion barrier layer () covering the first metallization (), which diffusion barrier layer is produced with a locally acting application method, and a second metal layer () arranged on the diffusion barrier layer () are provided, wherein the second metal layer () preferably contains gold and/or platinum and/or an alloy that has at least one of these elements. The invention also discloses a production method for an LTCC substrate structure of this type.

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Vaihingen, Germany

Michael Krenkel