Pdf Solutions, Incorporated

Michael Keleher

Jeffrey Drue David

Richard Gene Burch

Lin Lee Cheong

Tomonori Honda

Qing Zhu

Dennis Ciplickas

John Kibarian

Brian E Stine

Kenneth Harris

Said Akar

Vaishnavi Reddipalli

A template for assigning the most probable root causes for wafer defects. The bin map data for a subject wafer can be compared with bin map data for prior wafers to find wafers with similar issues. A probability can be determined as to whether the same root cause should be applied to the subject wafer, and if so, the wafer can be labeled with that root cause accordingly.

Wafer bin map based root cause analysis

Classifying wafers using Collaborative Learning. An initial wafer classification is determined by a rule-based model. A predicted wafer classification is determined by a machine learning model. Multiple users can manually review the classifications to confirm or modify, or to add user classifications. All of the classifications are input to the machine learning model to continuously update its scheme for detection and classification.

Collaborative learning model for semiconductor applications

Growing community of inventors

Seattle, WA, United States of America

Michael Keleher