Siemens Aktiengesellschaft

Rolls-royce Deutschland Ltd & Co. Kg

Michael Kaspar

Karl Weidner

Robert Weinke

Herbert Schwarzbauer

Jörg Zapf

Axel Kaltenbacher

Erhard Magori

Hans Wulkesch

Matthias Neumeister

Gernot Schimetta

Kai Kriegel

Stefan Kiefl

Laurence Amigues

Julian Seidel

Wolfgang Jarausch

Stephan Geisler

A three-dimensional arrangement for a power converter device, e.g., an inverter or a rectifier, is provided. The switching elements, activation electronics, the load connections of the power converter device are arranged on a carrier device in such a way that defines especially short conduction paths. The components of the power converter device (e.g., all required components), such as switching elements, control electronics, and load connections, are arranged on a common carrier device. The carrier device is simultaneously used as a cooling device for the entire switching device. The power converter device may thereby achieve particularly efficient performance.

Power converter arrangement and method for producing a power converter arrangement

A semiconductor chip device including a surface on which at least one electrical contact surface is provided. A foil from an electrically insulating material is applied, especially by vacuum, to the surface and rests closely to the surface and adheres to the surface. The foil, in the area of the contact surface, is provided with a window in which the contact surface is devoid of the foil and is contacted across a large area to at least one layer from an electroconductive material. In at least one embodiment, the layer from the electroconductive material is part of a flexible contact for electrically connecting the contact surface to at least one external connecting conductor.

Strip conductor structure for minimizing thermomechanical loads

One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.

Method for contacting electronic components by means of a substrate plate

At least one film composite is laminated on a surface of at least one electrical component. The film composite includes at least one electrically-conducting plastic film with at least one electrically conducting conductor. The electrically-conducting plastic film has a high-ohmic resistance. This method may be used in planar large-surface electrical contacting technology for the production of modules with power semiconductors, where an electrical contacting of the components is achieved by the plastic films. A low lateral electrical conductivity is achieved, such that an electrical charging of the plastic films required for the contacting technology is prevented on operation of the component or the module.

Electrical component and film composite laminated on the component and method for production

Disclosed is a method for producing a package. According to said method, a substrate is provided, on a surface of which one or several components are disposed, and a hermetically sealing protective layer is formed on the one or several components and on the surface of the substrate. The hermetically sealing protective layer is impermeable to gas, liquid, and electromagnetic waves, temperature-resistant, electrically insulating, and process-resistant.

Arrangement for hermetically sealing components, and method for the production thereof

A device, especially a piezo stack () has a plurality of stacked actuator or sensor layers with electrodes () or piezo stack () contacts. A flexible lead frame () is electrically connected to the electrodes ().

Contacting multilayer piezo actuators or sensors

Growing community of inventors

Putzbrunn, Germany

Michael Kaspar