Siemens Aktiengesellschaft

Infineon Technologies Ag

Michael Kaindl

Herbert Schwarzbauer

Manfred Bruckmann

Leo Lorenz

Peter Stern

Gerhard M&uuml;nzing

Manfred Br&uuml;ckmann

Herbert Prussas

Franz Taumberger

Helmut Haltenorth

Detlef Haberland

Werner Piepenburg

Rudolf Falkenstein

Ernst Vollmerhaus

Gerhard Münzing

A method for producing a microelectronic component of sandwich construction, which includes the steps of providing a first substrate which has a first conductor track plane, providing a plurality of semiconductor chips which have first contact faces electrically connected to the first conductor track plane, and second contact faces opposite the first sides. The method furthermore includes providing a second substrate which has a second conductor track plane with contact points, securing electrically conductive balls to the contact points of the second conductor track plane using an electrically conductive, flexible adhesive, applying an electrically conductive, flexible adhesive to the second contact faces of the plurality of semiconductor chips, and joining the first substrate and the second substrate together.

Method for producing a microelectronic component of sandwich construction

A microelectronic component of sandwich construction, that includes a first substrate with a first conductor track plane and a second substrate with a second conductor track plane, between which many semiconductor chips are disposed. The contacting of the second conductor track plane to the adjacent surface of the semiconductor chips is effected by fixed contacting means, in particular with the soldered connections, an electrically conductive adhesive, or electrically conductive balls. The microelectronic components of the invention are suitable in particular as power components and can be used for instance in inverters. The invention also relates to a method for producing the microelectronic component.

Microelectronic component of sandwich construction

A vertical plug-in single-in-line circuit module with a carrier for carrying a row of single-in-line mounted metal pins lying in the plane of the carrier along one carrier edge as outer electrical connections of one or more resistive elements such as a resistance area or resistance path. A first region of the resistive element is located closer to the metal pins of the carrier than a second region of the resistive element. Leads couple the metal pins to the resistive element. The first region lying closest to the metal pins is so constructed that it sees a higher heat dissipation per unit surface area during operation than the second region. The leads are connected to the resistive element such that the current can flow between the first region and second region.

Vertical plug-in single-in-line circuit module

A glass fiber bushing is provided for a wall opening of a housing which has a light-transmitting or a light receiving component mounted therein, the component having an optically-active location to be optimally coupled to the tip of the glass fiber. At least in the region of the opening through the housing, the glass fiber is firmly surrounded by and is secured in a stiff tube which is inserted through the wall opening. An adjustment member which adjusts the glass fiber position is slipped with a tight clearance over the tube and/or over a transition piece which is secured to the tube. An end face of the adjustment member is oriented toward the exterior surface of the housing in the region surrounding the wall opening. At least close to the tip of the glass fiber, the outer diameter of the glass fiber or of a glass fiber protective layer is surrounded by the inner wall of the tube with so little play that the tube defines the position of the tip of the glass fiber. In a region between the adjustment member and the component the tube is plugged through an elastic membrane of the wall opening. A surface of the membrane is secured to the housing in the area of the wall opening. The end face of the adjustment member which adjusts the position of the tube and, therewith, the position of the glass fiber is secured to the exterior surface of the housing.

Glass fiber bushing through a wall opening of a housing and method of

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München, Germany

Michael Kaindl