Rohm & Haas Electronic Materials LLC

Shipley Company LLC

Dow Global Technolgoies LLC

Rohm and Haas Company

Other

Rohm and Haas Electronic Materials Korea Ltd.

Ddp Specialty Electronic Materials Us, LLC

Michael K Gallagher

Yujian You

Anthony Zampini

Gregory P Prokopowicz

Robert H Gore

Kim Sang Ho

Mark Robert Winkle

David Fleming

Xiang-Qian Liu

Karen R Brantl

Elissei Iagodkine

Dana A Gronbeck

Zhifeng Bai

Deyan Wang

Robert K Barr

Christopher John Tucker

Owendi Ongayi

Duane R Romer

Jeffrey M Calvert

Timothy G Adams

Angelo Anthony Lamola

Matthew Martin Yonkey

Peter Trefonas, Iii

Ian A Tomlinson

Asghar Akber Peera

Robert Mitchell Blankenship

Corey O'Connor

Gerald B Wayton

Michelle Bowerman Riener

Matthew T Bishop

Glenn Nelson Robinson

Craig S Allen

Vipul Jain

Christopher D Gilmore

Eric Jon Langenmayr

Jake Joo

Mark S Oliver

Zidong Wang

Avin V Dhoble

Kevin Y Wang

Joseph F Lachowski

Nikoi Annan

Colin Hayes

Amy M Kwok

Alejo M Lifschitz Arribio

Xiang Qian Liu

Luis A Gomez

Raymond J Thibault

Chi Q Truong

Colin Calabrese

Jonathan D Prange

Stewart A Robertson

Alexander Zielinski

Gregory D Prokopowicz

Scott Alan Ibbitson

Larry Manziek

Aaron A Rachford

Zhebin Zhang

Charles R Kinzie

James Cyril Gallagher

Young-Seok Kim

Gregory Prokopowicz

Elissei Lagodkine

Tina Aoude

Michael A Petti

Yi Shen

Masaki Kondoh

There is provided a resin composition from a mixture including: (a) 60-90 weight % of at least one thermosetting resin; and (b) 10-40 weight % of at least one aryl ether resin. The resin composition can be used in electronics applications.

Polymeric resin for dielectric applications

Disclosed is a bis-imide compound comprising two or more aryl moieties substituted with ethynyl moieties and the two or more aryl moieties each having one or more polar substituents. Further disclosed is a polymer composition comprising a copolymer polymerized from a monomer mixture of (a) one or more first monomers comprising a bis-imide compound comprising two or more aryl moieties substituted with ethynyl moieties and the two or more aryl moieties each having one or more polar substituents; and (b) one or more second monomers comprising two or more cyclopentadienone moieties. The polymer compositions exhibit favorable properties for use in electronics and displays applications.

Polyimide-polyarylene polymers

Crystal plane orientation enrichment compounds are applied to copper to modify copper grain orientation distribution to the favorable crystal plain orientation to enhance copper electroplating. Electroplating copper on the modified copper enables faster and selective electroplating.

Method of enhancing copper electroplating

The present disclosure relates to a photosensitive composition comprising a photoinitiator and a bismaleimide component, photopolymers comprising the photosensitive composition and their use, especially in electronic devices. The bismaleimide component includes a bismaleimide compound or a bismaleimide oligomer.

Photosensitive bismaleimide composition

There is provided a polymer which is the copolymerization product from a mixture including: (a) 10-50 mol % of at least one addition polymerizable arylcyclobutene monomer; (b) 15-50 mol % of at least one addition polymerizable diene monomer; and (c) 15-60 mol % of at least one addition polymerizable aromatic vinyl monomer. The polymer can be used in electronic applications.

In a first aspect, methods are provided that comprise: (a) applying a curable composition on a substrate; (b) applying a hardmask composition above the curable composition; (c) applying a photoresist composition layer above the hard mask composition, wherein one or more of the compositions are removed in an ash-free process. In a second aspect, methods are provided that comprise (a) applying an organic composition on a substrate; (b) applying a photoresist composition layer above the organic composition, wherein the organic composition comprises a material that produce an alkaline-soluble group upon thermal and/or radiation treatment. Related compositions also are provided.

Coating compositions for photolithography

The present invention provides methods of making low energy polymerizable monomers and resins for use in making dielectric materials. The methods comprise deprotecting or deacylating an organic alkali cleavable protecting group containing addition polymerizable, amine containing aromatic monomer or oligoaromatic phenol resin containing an organic alkali cleavable protecting group, such as a Cto Calkanoyl group, preferably, an acyl group, by hydrolyzing to remove the protecting group in organic alkali in a polar solvent containing an excess of alkali Cto Calkoxide and form a hydroxyl functional monomer or resin, followed by; reacting via nucleophilic substitution the resulting hydroxyl functional monomer or resin with an alpha-halide (&#x3b1;-halide) or strong acid conjugate leaving group containing arylcyclobutene compound in a polar solvent, to yield a product an arylcyclobutene-containing addition polymerizable or amine containing aromatic monomer or oligoaromatic phenol resin having an ether linkage from the cyclobutene ring to an aromatic group of the addition polymerizable aromatic monomer, aromatic amine or oligoaromatic phenol.

Methods of making stable and thermally polymerizable vinyl, amino or oligomeric phenoxy benzocyclobutene monomers with improved curing kinetics

In one aspect, coating compositions are provided that comprise a component a component that comprises one or more silicon, antimony, aluminum, yttrium, cerium, lanthanum, tin, titanium, zirconium, hafnium, indium or zinc compounds. In another aspect, coating compositions are provided that comprise a plurality of discrete particles. Preferred coating compositions of the invention are useful for antireflective purposes, particularly with an underlaying photoresist coating layer, as well as for a barrier layer in immersion lithography.

Coating compositions

Arylcyclobutene polymers having improved physical properties, such as tensile strength, are provided. Compositions and methods for coating such arylcyclobutene polymers are also provided.

Arylcyclobutenes

Arylclobutene-containing multi-functional monomers are useful in the preparation of arylcyclobutene-based polymer coatings. Compositions comprising one or more arylclobutene-containing multi-functional monomers and one or more oligomers comprising as polymerized units one or more arylcyclobutene monomer provide arylcyclobutene-based polymer coatings having reduced stress. Such compositions are useful in the manufacture of electronic devices.

In one aspect, the present invention relates to coating compositions that comprise a resin component, wherein the predominant portion of the resin component comprising one or more resins that are at least substantially free of fluorine. Coating compositions of the invention are useful as photoresist overcoat layers, including in immersion lithography processing.

Coating compositions for photoresists

Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Ephemeral bonding

Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.

Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.

Adhesion promoter

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Hopkinton, MA, United States of America

Michael K Gallagher