Lanxide Technology Company, LP

M Cubed Technologies, Inc.

Other

Ii-vi Delaware, Inc.

Ii-vi Incorporated

Michael K Aghajanian

Marc S Newkirk

Allyn L McCormick

Christopher R Kennedy

Alan S Nagelberg

Danny R White

Michael A Rocazella

Robert C Kantner

Robert J Wiener

Andrew W Urquhart

Terry D Claar

Kurt J Becker

Ratnesh K Dwivedi

Gregory E Hannon

Gerhard H Schiroky

John T Burke

John P Biel, Jr

Ralph A Langensiepen

Mark Gordon Mortenson

Steven D Keck

Michael A Richmond

W Michael Waggoner

William B Johnson

Harry Richard Zwicker

Vilupanur Alwar Ravi

Edward Gratrix

Birol Sonuparlak

Prashant G Karandikar

Stanislav Antolin

Dave K Creber

Barry R Rossing

Kenneth S Hatton

Sylvia J Canino

Bradley N Morgan

Anthony F Liszkiewicz, Jr

Alexander Lukacs, Iii

James A Jensen

Jerry G Weinstein

Kevin P Pochopien

Eugene S Park

Harold D Lesher

Dennis James Landini

Steven M Mason

Jonathan Wayne Hinton

Steven J Taylor

John Jennings Crowther

Brian E Schultz

Jon Coppola

Nicholas Coombs

Jiwen Wang

Wen-Qing Xu

Elgin E Eissler

Chao Liu

Jack A Kuszyk

Charles D Tanner

Derek Rollins

Thomas James Henderson

Charles J Kraisinger

Aspi N Patel

Brian J Monti

Craig B Shumaker

Glen Evans

Marlene Rossing, Legal Representative

David Casale

Daniel Mastrobattisto

Peter M Engelgau

Gregory E Hanon

John Peter Biel

Allyn Leslie McCormick

Austin Scott McDannald

Michael S Epperly

Cheng-Tsin Lee

Dennis J Landini

Michael A Roczella

Sam Salamone

Russell G Smith

A reaction-bonded silicon carbide (SiC) body is produced by: providing a preform including ceramic elements and carbon, and one or more surface features; providing a powder which includes diamond particles and carbon; locating the powder in the surface feature(s); and infiltrating the preform and the powder with molten silicon (Si) to form reaction-bonded SiC in the preform, and to form reaction-bonded SiC coatings on the diamond particles. The present disclosure also relates to a device/component which includes: a main body portion and discrete elements located at least partially within the main body portion. The main body portion may include reaction-bonded SiC and Si, but not diamond, while the discrete elements include diamond particles, reaction-bonded SiC coatings surrounding the diamond particles, and Si. According to the present disclosure, diamond may be advantageously located only where it is needed.

Silicon carbide body with localized diamond reinforcement

An article includes a ceramic material and features a machined surface that is characteristic of cold ablation laser machining, and the machined surface exhibits no visible oxidation. A laser machining apparatus and technique is based on cold-ablation, but is modified or augmented with an inert assist gas to minimize deleterious surface modifications and mitigate oxide formation associated with laser machining.

Inert gas-assisted laser machining of ceramic-containing articles

A chemical-mechanical polishing/planarization pad conditioner body made from diamond-reinforced reaction bonded silicon carbide, with diamond particles protruding or 'standing proud' of the rest of the surface, and uniformly distributed on the cutting surface. In one embodiment, the diamond particles are approximately uniformly distributed throughout the composite, but in other embodiments they are preferentially located at and near the conditioning surface. The tops of the diamond particles can be engineered to be at a constant elevation (i.e., the conditioner body can be engineered to be very flat). Exemplary shapes of the body may be disc or toroidal. The diamond particles can be made to protrude from the conditioning surface by preferentially eroding the Si/SiC matrix. The eroding may be accomplished by electrical discharge machining or by lapping/polishing with abrasive.

Diamond composite CMP pad conditioner

A perforated film electrode for a pinned electrostatic chuck that lies below the top surface of the pins in the valleys or interstices between pins, below the elevation of the top surface of the pins, and is attached to the body of the chuck. In one embodiment, the perforated film electrode assembly features a thin film electrode sandwiched between thin sheets of electrically insulating material. The top, outer or exposed surface of the perforated film electrode assembly has a flatness that is maintained within 3 microns. That is, the distance or elevation between the tops of the pins and the top surface of the perforated film unit is maintained within plus or minus 3 microns. A tool for producing a uniform elevation of the top and bottom sheets or layers of electrically insulating material also is taught.

Film electrode for electrostatic chuck

A multilayer substrate includes a diamond layer CVD grown on a composite layer. The composite layer includes particles of diamond and silicon carbide and, optionally, silicon. A loading level (by volume) of diamond in the composite layer can be &#x2267;5%; &#x2267;20%; &#x2267;40%; or &#x2267;60%. The multilayer substrate can be used as an optical device; a detector for detecting radiation particles or electromagnetic waves; a device for cutting, drilling, machining, milling, lapping, polishing, coating, bonding, or brazing; a braking device; a seal; a heat conductor; an electromagnetic wave conductor; a chemically inert device for use in a corrosive environment, a strong oxidizing environment, or a strong reducing environment, at an elevated temperature, or under a cryogenic condition; or a device for polishing or planarization of other devices, wafers or films.

Substrate including a diamond layer and a composite layer of diamond and silicon carbide, and, optionally, silicon

Composite bodies made by a silicon metal infiltration process that feature a silicon intermetallic, e.g., a metal silicide. Not only does this give the composite material engineer greater flexibility in designing or tailoring the physical properties of the resulting composite material, but the infiltrant also can be engineered compositionally to have much diminished amounts of expansion upon solidification, thereby enhancing net-shape-making capabilities. These and other consequences of engineering the metal component of composite bodies made by silicon infiltration permit the fabrication of large structures of complex shape.

Intermetallic-containing composite bodies, and methods for making same

A diamond-reinforced SiC ceramic composite material and shaped article. The addition of diamond to the microstructure greatly enhances properties such as hardness and Young's modulus. Such a composite material has considerable promise as an armor material. In particular, significant increases in ballistic performance can be achieved versus a non-diamond-containing composite, particularly versus the M993 threat. Reaction bonded silicon carbide (RBSC) ceramics with 7% diamond were shown to offer ballistic performance levels that matched the best commercial ceramics tested on the program.

Diamond-reinforced composite materials and articles, and methods for making same

Current top performing SAPI systems are BC-containing (hot pressed BC or reaction bonded BC). These systems will not function well versus future WC/Co threats due to the inability of BC to withstand high pressure impacts. New approaches will be needed for next generation SAPI ceramics. Three related concepts are disclosed herein, each of which will lead to improved reaction bonded ceramics for next generation SAPI applications. The first concept aims to reactively heat treat reaction bonded BC, causing. SiC and SiBto form at the expense of BC. The second approach will add Ti to the system, thus allowing TiC and TiBto form at the expense of BC. Finally, the third concept will evaluate the use of finer particle sizes, thus improving the static properties of the ceramics (with the aim of enhancing multi-hit performance). In all cases, preliminary work has been conducted to demonstrate the viability of the concepts. This will lead to a new family of advanced armor ceramics. These new armor ceramics will allow the modern soldier to be better protected versus next generation, high level threats (e.g., high pressure WC/Co projectiles) with a more ergonomic package (lower weight, less bulk). Further, the results disclosed herein will yield improvement versus the current tool steel threats.

Composite materials and methods for making same

Composite bodies made by a silicon metal infiltration process that feature a metal phase in addition to any residual silicon phase. Not only does this give the composite material engineer greater flexibility in designing or tailoring the physical properties of the resulting composite material, but the infiltrant also can be engineered compositionally to have much diminished amounts of expansion upon solidification, thereby enhancing net-shape-making capabilities. These and other consequences of engineering the metal component of composite bodies made by silicon infiltration permit the fabrication of large structures of complex shape. Certain liquid-based preforming techniques are particularly well suited to the task, particularly where a high volumetric loading of the reinforcement component is desired.

Silicon-containing composite bodies, and methods for making same

A composite body produced by a reactive infiltration process that possesses high mechanical strength, high hardness and high stiffness has applications in such diverse industries as precision equipment and ballistic armor. Specifically, the composite material features a boron carbide filler or reinforcement phase, and a silicon component with a porous mass having a carbonaceous component. Potential deleterious reaction of the boron carbide with silicon during infiltration is suppressed by alloying or dissolving boron into the silicon prior to contact of the silicon infiltrant with the boron carbide. In a preferred embodiment of the invention related specifically to armor, good ballistic performance can be advanced by loading the porous mass or preform to be infiltrated to a high degree with one or more hard fillers such as boron carbide, and by limiting the size of the largest particles making up the mass. The instant reaction bonded silicon carbide (RBSC) composite bodies surpass previous RBSC's as armor materials, and in this capacity approach the ballistic performance of current carbide armor ceramics but with potentially lower cost manufacturing methods, e.g., infiltration techniques.

Boron carbide composite bodies, and methods for making same

A composite body produced by a reactive infiltration process that possesses high mechanical strength, high hardness and high stiffness has applications in such diverse industries as precision equipment and ballistic armor. Specifically, the composite material features a boron carbide filler or reinforcement phase, and a silicon carbide matrix produced by the reactive infiltration of an infiltrant having a silicon component with a porous mass having a carbonaceous component. Potential deleterious reaction of the boron carbide with silicon during infiltration is suppressed by alloying or dissolving boron into the silicon prior to contact of the silicon infiltrant with the boron carbide. In a preferred embodiment of the invention related specifically to armor, good ballistic performance can be advanced by loading the porous mass or preform to be infiltrated to a high degree with one or more hard fillers such as boron carbide, and by limiting the size of the largest particles making up the mass. The instant reaction-bonded silicon carbide (RBSC) composite bodies surpass previous RBSC's as armor materials, and in this capacity approach the ballistic performance of current carbide armor ceramics but with potentially lower cost manufacturing methods, e.g., infiltration techniques.

Silicon infiltration technology, e.g., siliconizing or reaction-bonding, is used to produce ceramic-rich composite bodies having utility as ballistic armor. In the main embodiment of the invention, the ballistic armor includes a reaction-bonded silicon carbide body (RBSC). Good ballistic performance can be advanced by loading the porous mass or preform to be infiltrated to a high degree with one or more hard fillers, and by limiting the size of the morphological features making up the composite body. This control of 'grain size' can be accomplished by controlling the size of the largest particles making up the porous mass to be infiltrated, but also of importance is controlling the processing conditions, particularly by controlling the factors that cause grain growth, coarsening of microstructure, and/or grain coalescence.

Ceramic-rich composite armor, and methods for making same

A silicon-containing composite body that would otherwise be brittle can be engineered to exhibit enhanced fracture toughness. Specifically, a silicon-ceramic composite body is produced, preferably by a reactive infiltration technique. The ceramic is selected such that it has a higher coefficient of thermal expansion (CTE) than does the silicon phase. At least at some point during processing, the silicon phase is at a temperature above its normal ductile/brittle transition temperature of about 500&#xb0; C., and preferably above its melting point. The formed composite body containing the silicon phase is then cooled below its ductile/brittle transition. During cooling, the ceramic phase shrinks more than does the silicon phase, thereby placing the latter in a state of compressive stress. By the time the composite body has cooled to substantially ambient temperature, the induced compressive stress in the silicon phase is sufficient as to impart a measurable degree of semi-ductile character to the silicon phase. This pseudo-ductility manifests itself in the composite body as a significant increase in the fracture toughness of the body. For example, when the ceramic reinforcement was boron carbide particulate instead of silicon carbide (which has a CTE similar to that of silicon), fracture toughness increased by almost 30 percent.

Toughness enhanced silicon-containing composite bodies, and methods for making same

Improved silicon carbide composites made by an infiltration process feature a metal phase in addition to any residual silicon phase. Not only are properties such as mechanical toughness improved, but the infiltrant can be so engineered as to have much diminished amounts of expansion upon solidification, thereby enhancing net-shape-making capabilities. Further, multi-component infiltrant materials may have a lower liquidus temperature than pure silicon, thereby providing the practitioner greater control over the infiltration process. In particular, the infiltration may be conducted at the lower temperatures, where low-cost but effective bedding or barrier materials can terminate the infiltration process once the infiltrant has migrated through the permeable mass up to the boundary between the mass and the bedding material.

Silicon carbide composites, and methods for making same

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Newark, DE, United States of America

Michael K Aghajanian