Dow Corning Corporation

Michael John Watson

Michael A Lutz

Dongchan Ahn

Nick Evan Shephard

Ann Walstrom Norris

Khristopher Edward Alvarez

Andrew Anthony Mojica

Michael David Heying

Pamela Jean Huey

Patricia Kathryn Moline

A composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule, with the proviso that component (II) is free of fluorine atoms; (III) a hydrosilylation catalyst; (IV) a fluoroorganosilicone, with the provisos that (1) component (IV) has at least one functional group reactive with component (I), component (II), or both, (2) when component (II) is not present, then component (IV) has an average of at least two silicon-bonded hydrogen atoms per molecule, and (3) component (IV) is added to the composition in an amount sufficient to provide chemical resistance to a cured product of the composition; and (V) an adhesion promoter.

Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance

Die attach adhesives and methods for their use, along with the devices that are obtained by the use of the methods. Using semiconductor chips as an example, the adhesives and the method for using them provides an interface between a chip (die) and the chip support. The method includes creating a space between the chip and the chip support of a given sized opening.

Adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes

Die attach adhesives and methods for their use, along with the devices that are obtained by the use of the methods. Using semiconductor chips as an example, the adhesives and the method for using them provides an interface between a chip (die) and the chip support. The method includes creating a space between the chip and the chip support of a given sized opening by using inorganic insulator particles having an average particle size of 1 &mgr;m to 1000 &mgr;m and a major axis to minor axis ratio of about 1.0 to 1.5.

Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes

A silicone composition for preparing a silicone pressure sensitive adhesive, the composition comprising (A) 20 to 55 parts by weight of a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 45 to 80 parts by weight of an organopolysiloxane resin consisting essentially of R,SiO,units and SiO,units, wherein the total amount of components (A) and (B) is 100 parts by weight; (C) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition; (D) 25 to 200 parts by weight of a silica filler having an average surface area less than 25 m,/g; and (E) a catalytic amount of a hydrosilylation catalyst. Each R,is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups. The mole ratio of R,SiO,units to SiO,units in the organopolysiloxane resin is from 0.6:1 to 1.5:1 and the resin contains less than about 2 mole percent of alkenyl groups. The sun of the average number of silicon-bonded alkenyl groups per molecule in component (A) and the average number of silicon-bonded hydrogen atoms per molecule in component (C) is greater than 4. A silicone pressure sensitive adhesive comprising a reaction product of the above-described composition. A multi-part silicone composition comprising components (A) through (E) in two or more parts, provided neither component (A) nor component (B), when component (B) contains alkenyl groups, are present with components (C) and (E) in the same part.

Silicone composition and silicone pressure sensitive adhesive

A silicone composition for preparing a silicone pressure sensitive adhesive, the composition comprising (A) 20 to 55 parts by weight of a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 45 to 80 parts by weight of an organopolysiloxane resin comprising R.sup.3.sub.3 SiO.sub.1/2 units and SiO.sub.4/2 units wherein each R.sup.3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups, the mole ratio of R.sup.3.sub.3 SiO.sub.1/2 units to SiO.sub.4/2 units is from 0.6:1 to 1.5:1, the resin contains less than about 2 mole percent of alkenyl groups, and the total amount of components (A) and (B) is 100 parts by weight; (C) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition; (D) a thixotropic agent in an amount sufficient to impart thixotropy to the composition; and (E) a catalytic amount of a hydrosilylation catalyst; wherein the sum of the average number of silicon-bonded alkenyl groups per molecule in component (A) and the average number of silicon-bonded hydrogen atoms per molecule in component (C) is greater than 4. A silicone pressure sensitive adhesive comprising a reaction product of the silicone composition. A multi-part silicone composition comprising components (A) through (E) in two or more parts, provided neither component (A) nor component (B), when components (B) contains alkenyl groups, are present with components (C) and (E) in the same part.

Silicone composition and silicone pressure sensitive adhesive formed

A curable composition which contains an alkenyl group containing polyorganosiloxane, an organosilicon compound having two silicon-bonded hydrogen atoms, a hydrosilylation reaction catalyst, and a glass frit, which is suitable, upon cure, for use as a firewall sealant.

Firewall sealant

The adhesion developed during curing of organosiloxane compositions comprising a polyorganosiloxane containing silicon-bonded alkenyl and fluorinated alkyl radicals, at least one organosiloxane as the curing agent, a platinum-containing hydrosilation catalyst and conventional organosiloxane adhesion promoters is substantially improved when the alkenyl-substituted siloxane units are separated from the closest fluorine-containing siloxane units by at least one dimethylsiloxane unit.

Growing community of inventors

Midland, MI, United States of America

Michael John Watson