Lexmark International, Inc.

Funai Electric Company Ltd.

Funai Electric Holdings Co., Ltd.

Michael John Dixon

Jeanne Marie Saldanha Singh

Frank Edward Anderson

Bryan McKinley

Yimin Guan

Xiaorong Cai

Richard Earl Corley

Elios Klemo

Ann P Holloway

Jiandong Fang

Zhigang Xiao

George Nelson Woolcott

Robert Wilson Cornell

Curtis Ray Droege

Eric Spencer Hall

Timothy Lowell Strunk

Alan Stirling Campbell

Xiaoming Wu

Mark Duane Foster

Martin Victor DiGirolamo

James Paul Drummond

Pramod K Sharma

Robert Francis Soto

Patrick Andrew Buxton

Donald Thomas Kral

Paul Sacoto

Robert Edward Hackett

Kenneth Daniel Seevers

Amanda Kay Plakosh-Angeles

James Caro Lurton

Jerry Randall Reed

Joe Leroy McGuire

Geoffrey Kyle Canter

Kristoffer Alan Hazen

An aqueous composition for forming a micro-fluid jet printable dielectric film layer, methods for forming dielectric film layers, and dielectric film layers formed by the method. The aqueous composition includes from about 5 to about 20 percent by 65 weight of a polymeric binder emulsion, from about 10 to about 30 percent by weight of a humectant, from about 0 to about 3 percent by weight of a surfactant, and an aqueous carrier fluid. The aqueous composition has a viscosity ranging from about 2 to about 6 centipoise at a temperature of about 23&#xb0; C.

Thermally inkjettable acrylic dielectric ink formulation and process

In an imaging device having a photoconductive drum and a lubricant applicator brush, methods and apparatus teach application of the lubricant to the drum at a transfer nip and removing undeveloped toner particles. A first voltage is applied to the drum while the brush receives a voltage that switches more positive and more negative than the first voltage. It attracts to the brush from the drum negatively and positively charged toner. Embodiments contemplate amounts of voltages and frequencies of switching. An elongate rod contacts the brush downstream of the transfer nip to flicker off the toner particles from the brush. The rod can also have voltages applied and switched greater than and lesser than the voltages of the applicator brush to facilitate toner removal. A cleaning blade downstream of the transfer nip scrapes clean a surface of the drum.

Biased lubricant applicator brush in imaging device

A micro-fluid ejection head has an ejection chip to expel fluid. It connects to a laminate construct. The construct has vertically configured wiring layers interspersed with non-conductive layers, such as carbon fiber layers. An upper of the wiring layers electrically connects to the ejection chip. The upper layer may also support a planar undersurface of the chip directly on a surface or in a recessed pocket. The two can connect with a die bond, such as one having silica or boron nitride. Fluid connections exist between ink feed slots of the chip and the laminate construct. A silicon tile or other material may also fluidly interconnect with the two. A plastic manifold optionally supports the laminate construct and may fluidly connect to it. The wiring layers of the laminate contemplate ground, power, and various bond pads. Other construct layers contemplate prepreg or core FR4 layers.

Laminate constructs for micro-fluid ejection devices

An aqueous composition for forming a micro-fluid jet printable dielectric film layer, methods for forming dielectric film layers, and dielectric film layers formed by the method. The aqueous composition includes from about 5 to about 20 percent by weight of a polymeric binder emulsion, from about 10 to about 30 percent by weight of a humectant, from about 0 to about 3 percent by weight of a surfactant, and an aqueous carrier fluid. The aqueous composition has a viscosity ranging from about 2 to about 6 centipoise at a temperature of about 23&#xb0; C.

Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.

Printheads and method for assembling printheads

A micro-fluid ejection head has an ejection chip to expel fluid. It connects to a laminate construct. The construct has vertically configured wiring layers interspersed with non-wiring layers, such as carbon fiber layers. An upper of the wiring layers electrically connects to the ejection chip. The upper layer may also support a planar undersurface of the chip directly on a surface or in a recessed pocket. The two can connect with a die bond, such as one having silica or boron nitride. Fluid connections exist between ink feed slots of the chip and the laminate construct. A silicon tile or other material may also fluidly interconnect with the two. A plastic manifold optionally supports the laminate construct and may fluidly connect to it. The wiring layers of the laminate contemplate ground, power, and various bond pads. Other construct layers contemplate prepreg or core FR4 layers.

An ink manifold constructed with a number of semiconductor tiles which are fastened end to end on a rigid base member to form a page wide print mechanism. Each tile is constructed with ink channels on one side in liquid communication with ink outlet ports on the opposite side. The ink channels carry ink from ports in the base member to the outlet ports of the tiles. The interface between each tile defines a boundary. An inkjet printhead is fastened over each boundary of the tiled manifold so that the ink inlet ports of the printhead are aligned with the ink outlet ports of the underlying tiles. No ink passes across the boundary of the adjacent manifold tiles. The fabrication of the individual tiles from a semiconductor wafer facilitates usage of the wafer when fabricating page wide print mechanisms.

Tiled manifold for a page wide printhead

Methods for fabricating micro-fluid ejection heads and micro-fluid ejection heads are provided herein, such as those that use non-conventional substrates. One such micro-fluid ejection head includes a substrate having first and second glass layers disposed adjacent to a surface thereof and a plurality of fluid ejection actuators disposed adjacent to the second glass layer. The first glass layer is thicker than the second glass layer and the second glass layer has a surface roughness of no greater than about 75 &#x212b; Ra.

Micro-fluid ejection heads with multiple glass layers

Micro-fluid ejection devices, methods for making micro-fluid ejection, heads, and micro-fluid ejection heads having N actuators on a first substrate and logic capable of driving the N actuators on a second substrate. The ejection heads also have less than N electrical connections between the first and second substrates.

Micro-fluid ejection devices having reduced input/output addressable heaters

A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTTC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors.

Composite ceramic substrate for micro-fluid ejection head

An ink jetting structure includes a substrate that has a first surface and a second surface. A heater chip is mounted to the second surface of the substrate, and includes a first set of electrical contacts. A printhead circuit member has a third surface, a fourth surface, and an opening configured to receive the heater chip with the first set of electrical contacts of the heater chip being exposed through the opening. The third surface is mounted to the second surface of the substrate. The fourth surface has a second set of electrical contacts attached by wire bonds to the first set of electrical contacts. The third surface has a third set of electrical contacts electrically coupled to the second set of electrical contacts, and electrically connected to a flexible cable for coupling to corresponding contacts on a printer.

Ink jetting structure having protected connections

Growing community of inventors

Richmond, KY, United States of America

Michael John Dixon