Electro Scientific Industries, Inc.

Nanometrics Inc.

Allagi Incorporated

Michael John Darwin

Mathew Noel Rekow

Mehmet Emin Alpay

Jeffrey Howerton

Glenn Simenson

Haibin Zhang

Robert B Reichenbach

James Brookhyser

Qian Xu

Timothy Andrew Johnson

Boris V Kamenev

Fang Shan

Min Zhang

Joe Frankel

Jack Rundel

Matthew Pysher

A system can include an axis, a motor coupled with the axis and configured to rotate the axis, an optical modulator coupled with the axis and configured to be rotated by the axis, a lens element, a projection surface, a laser device configured to shine light through the optical modulator to project structured light onto the projection surface through the lens element, and a sensor configured to capture an image of a sample and structured light that is reflected from the projection surface and the sample surface. The system can also include a computing system having a synchronization module configured to phase lock the system by coordinating the laser device and the sensor and an analysis module configured to compute a three-dimensional (3D) object based on the structured light that is reflected from the projection surface and the sample surface.

Heterodyning optical phase measuring device for specular surfaces

A system can include an axis, a motor coupled with the axis and configured to rotate the axis, an optical modulator coupled with the axis and configured to be rotated by the axis, a lens element, a projection surface, a light source configured to shine light through the optical modulator to project structured light onto the projection surface through the lens element, and a sensor configured to capture an image of a sample and structured light that is reflected from the projection surface and the sample surface. The system can also include a computing system having a synchronization module configured to phase lock the system by coordinating the light source and the sensor and an analysis module configured to compute a three-dimensional (3D) object based on the structured light that is reflected from the projection surface and the sample surface.

The present invention is a method for separating a workpiece from a common substrate. It includes the steps of providing the workpiece, generating, within a beam source, a beam of laser pulses configured to modify a portion of the workpiece, determining a depth for creating a modified region based upon a characteristic of the workpiece and modifying a plurality of regions within the workpiece to form a plurality of modified regions. Modifying the plurality of regions includes directing the beam of laser pulses from an output of the beam source onto the workpiece, causing relative motion between the workpiece and the output of the beam source while directing the beam of laser pulses onto workpiece, and modifying a characteristic of the pulses of the beam upon generating a number of pulses which generally correspond to creating the modified regions to the determined depth.

Method and apparatus for separation of workpieces and articles produced thereby

Numerous embodiments of interactive control systems, methods of making the same, and devices incorporating the same are disclosed. In one embodiment, a system includes a light-resistant material; light-transmissive holes penetrating in a light-transmissive pattern through the light resistant material; and a lens disposed adjacent to the light-transmissive pattern.

Interactive control system, methods of making the same, and devices incorporating the same

The properties of a surface of an object in presence of thin transparent films are determined by generating a library of model signals and processing a measurement signal via searching the library to evaluate films properties and topography. The library may be reduced with principal component analysis to enhance computation speed. Computation enhancement may also be achieved by removal of the height contributions from the signal leaving only the film contribution in the signal. The film measurement signal is compared to a library of film signals to determine the film parameters of the sample. The library of film signals is produced by processing each full signal in a library to similarly remove the height contributions leaving only the film contributions. Additionally, a post-analysis process may be applied to properly evaluate local topography.

Thin films and surface topography measurement using reduced library

An optical metrology device determines the local stress in a film on a substrate. The metrology device maps the thickness of the substrate prior to processing. After processing, the metrology device determines the surface curvature of the substrate caused by the processing and maps the thickness of a film on the top surface after of the substrate after processing. The surface curvature of the substrate may be determined as basis functions. The local stress in the film is then determined using the mapped thickness of the substrate, the determined surface curvature, and the mapped thickness of the film. The local stress may be determined using Stoney's equation that is corrected for non-uniform substrate curvature, non-uniform film thickness, and non-uniform substrate thickness.

Local stress measurement

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Portland, OR, United States of America

Michael John Darwin