Corning Incorporated

Michael John Bennett

William Peter Addiego

Martin Herbert Goller

Benjamin Zain Hanson

Tracey Lynn Timmons

Michael Patrick Carson

Jeffrey Scott Davis

Disclosed herein are methods for bonding refractory substrates, such as zircon substrates, without the use of a bonding agent. Exemplary methods include (a) providing a plurality of refractory components, each component having at least one surface to be bonded, (b) polishing each surface to be bonded to a surface roughness (R) of 200 nm or finer, (c) contacting the surfaces to be bonded to form an unbonded refractory substrate, (d) firing the unbonded refractory substrate, and (e) subjecting the surfaces to be bonded to a compressive force during firing. Methods for making refractory forming bodies are also disclosed herein.

Method for bonding zircon substrates

An article having a flow-through substrate having open channels defined by porous walls, wherein the flow-through substrate includes alumina; and a COsorbent disposed on the flow-through substrate, wherein the COsorbent impregnates the porous walls of the flow-through substrate. Methods of making the article, its use for COcapture, and methods for regenerating the article for further use are also disclosed.

Article for carbon dioxide capture

A creep-resistant zircon article and a method of manufacturing the creep-resistant zircon article are described herein. In one example, the creep-resistant zircon article has the shape of a forming apparatus (e.g., isopipe) which is used in the fusion process to manufacture glass sheets.

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Corning, NY, United States of America

Michael John Bennett