Solid State Measurements, Inc.

Michael John Adams

William H Howland

William J Alexander

James Healy, Jr

A method of processing a semiconductor wafer includes utilizing a heated gas to heat at least one part of a semiconductor wafer by convection whereupon at least one contaminant is desorbed therefrom. A stream of cooling gas is caused to pass over the one part of the semiconductor wafer in the absence of heated gas to cool the one part of the semiconductor wafer. A metrology tool is then caused to measure at least one part of the semiconductor wafer to determine at least one characteristic thereof.

Semiconductor substrate surface preparation using high temperature convection heating

A sample chuck for supporting sample semiconductor wafers during testing includes an upper layer formed from a semiconducting material laminated to a lower layer formed from a conducting material.

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Olmstead Falls, OH, United States of America

Michael John Adams