Delphi Technologies, Inc.

Fairfield Manufacturing Company, Inc.

Michael Jeffrey Lowry

David E Cornell, Ii

Kevin M Gertiser

Thomas Alan Degenkolb

Karl A Schten

Eric A Brauer

Ronald M Shearer

Richard A Ripple

Jim M Spall

Victor C M Wong

Systems and methods for a temperature measurement device. A transmission includes a rotatable housing. The temperature measurement positioned on a transmission housing. The interior volume of the rotatable housing is partially filled with lubricant of transmission components residing within the interior volume of the housing. The temperature measurement device in contact with the lubricant and in communication with a device exterior to the transmission.

Gearbox temperature measurement device

A transmission in combination with a temperature measurement device and a device exterior to the transmission. The transmission includes a rotatable housing which drives a wheel of a vehicle, a wireless transceiver in communication with a thermistor embedded within molding, a battery embedded within the molding, and the molding resides within the housing. The temperature measurement device resides in a wall of the rotatable housing and the rotatable housing includes an interior volume. The interior volume of the rotatable housing is partially filled with oil for lubrication of transmission components residing within the interior volume of the housing. The temperature measurement device is rotated through the oil and out of the oil within the rotating housing when the rotating housing is in motion. The wireless transceiver is in communication with the device exterior to the transmission and communicates a temperature measurement from the temperature sensor and battery state of charge information to the device exterior to the transmission.

An immersion cooling apparatus includes a multi-terminal thermally conductive module that supports and encloses a power semiconductor device and a housing defining a flow-through chamber in which the thermally conductive module is mounted and through which liquid coolant is circulated. The thermally conductive module has first and second oppositely disposed connector headers housing terminal pins or blades electrically coupled to the semiconductor device, and the connector headers protrude through openings in oppositely disposed sidewalls of the housing so that the portion of the thermally conductive module between the connector headers is suspended in the chamber and immersed in the circulating coolant. The thermally conductive module is sealed against the housing sidewalls around the openings, and one of the sidewalls is removable to facilitate installation of the thermally conductive module in the housing or its subsequent removal.

Immersion cooling apparatus for a power semiconductor device

A thermal conduction structure is integrated into a multi-layer circuit board to thermally couple a power electronic device to a heatsink while electrically isolating the power electronic device from the heatsink. The thermal conduction structure includes a stack of alternatingly insulative and conductive layers, a first set of vertical vias that thermally and electrically join the power electronic device to a first set of conductive layers, and a second set of vertical vias that thermally and electrically join the heatsink to a second set of conductive layers that are interleaved with the first set of conductive layers.

Multi-layer electrically isolated thermal conduction structure for a circuit board assembly

A leaded semiconductor power module includes a first heatsink, an electrically insulated substrate thermally coupled to the first heatsink, one or more semiconductor chips, a leadframe substrate, and a second heatsink thermally coupled to the leadframe substrate, the assembly being overmolded with an encapsulant to expose the first heatsink, the second heatsink and peripheral terminals of the leadframe substrate. The semiconductor chips are electrically and structurally coupled to both the insulated substrate and the leadframe substrate, and conductive spacers electrically and structurally couple the insulated substrate to the leadframe substrate.

Growing community of inventors

Indianapolis, IN, United States of America

Michael Jeffrey Lowry