Texas Instruments Corporation

Michael Jay Jenson

David Matthew Curran

Eric Robert Trumbauer

Vince Christian Samek

Jon Evan Button

Brant William Paquette

Charles David Gordon

A method of providing a semiconductor device and a computer-readable medium having instructions for performing the method are disclosed. The method includes receiving a first wafer defect map that defines comparison regions and identifies visual defect locations for a wafer. A format of the comparison regions is determined, with the format chosen from a group including die-to-die, partial-shot-to-partial-shot and full-shot-to-full-shot. If the comparison format is not die-to-die, mapping information is received that provides die locations within the comparison regions. A wafer layout map is provided that identifies die locations within the wafer.

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Richardson, TX, United States of America

Michael Jay Jenson