Intel Corporation

Michael Jassowski

Ashwin Thirunahari

Anil Nanduri

Baptiste Tripard

Keith Smith

The disclosure generally provides methods, systems and apparatus for networked drone systems. In an exemplary networked drone system, a plurality of smaller drones are attached to a fixed platform to increase delivery payload, distance, reliability and safety. As a drone nears charge depletion, it is replaced in-flight with a new drone. Thus, the networked drone system need not be grounded to replace the depleted drone. In another embodiment, flight efficiency is increased by providing collapsible wins to the networked drone system.

Systems, cableless drone swarm systems, method and apparatus

Systems and methods may use a drone swarm to increase cargo capacity. A drone swarm may include a networked drone system or two or more drones, such as a parent drone and a child drone. A method may include receiving support component balance information captured by an inertial measurement unit on the support component supported by a parent drone, adjusting movement of the parent drone according to a control system using the support component balance information, receiving an indication of a low battery in a drone in the networked drone system, the indication including an identification of a replacement drone to replace the drone with the low battery in the networked drone system, and sending a reconfiguration command to at least one child drone to incorporate the replacement drone in the networked drone system.

Drone swarm for increased cargo capacity

An embodiment of an integrated circuit die with staggered bond pads and optimized driver layout includes a staggered array of bond pads with an outer ring of bond pads and an inner ring of bond pads. Driver/ESD circuit cells for the outer ring of bond pads are located to the outside of the bond pads (between the outer ring of bond pads and the nearest die edge). The driver/ESD cells for the inner ring of bond pads are located to the inside of the bond pads (between the inner ring of bond pads and the die core). The integrated circuit die is coupled to a lead frame via bond wires.

Semiconductor device inlcluding optimized driver layout for integrated circuit with staggered bond pads

A layout arrangement which provides a contouring of cells that allows the individual rectangular cell boundaries to overlap each other to a point at which individual device edges abut one another thereby utilizing die area which is normally lost to use. In order to attain this result, a new cell contour boundary is described about each cell at the edge of each individual device adjacent the exterior of the cell at a distance at which other cells may abut without disturbing the operation of the cell. Then, computer implemented processes are applied to cause the cells to fit abutting the newly described boundaries.

Standard semiconductor cell with contoured cell boundary to increase

Method of cell contouring to increase device density

An arrangement for providing power to a semiconductor array of cells on a substrate in which the metal 2 power conductors are truncated into short lengths sufficient only to reach between the metal 1 power conductors of adjacent rows of cells, the metal 2 power conductors are placed under the metal 4 power conductors at each side to reduce the current through the metal 3 power conductors, and the metal 3 power conductors are narrowed to the level necessary to carry the reduced current and placed adjacent upper or lower edges of the cells. The arrangement increases the amount of space available for access to the external connection nodes of the devices in the cells of a group on a substrate while reducing the size of the metal overlays necessary to carry power to the cells.

Growing community of inventors

El Dorado, CA, United States of America

Michael Jassowski