Microsoft Technology Licensing, LLC

Michael James Nystrom

Jincheng Wang

Wyatt Owen Davis

Chuan Pu

Kingsuk Maitra

Joseph Michael Luizzi

Mark Alan Champion

Joshua Owen Miller

Utku Baran

Richard Allen James

Seungwoo Lee

Robert J Dyer

Electrical connections are created between the actuator frame of a piezoelectric MEMS scanning mirror system and the substrate separate from the structural adhesive creating the mechanical bond between the actuator frame and the substrate. A structural bond (with no conducive properties) is formed between the actuator frame and the substrate. After the bond is fully formed, separate electric connections can be created by one or both of: 1) coating the actuator frame with a coating that enables a surface of the actuator frame to be wire bondable and creating a wire bond between the actuator frame and the substrate; or 2) depositing a trace of conductive material on the outside edge of the mechanical bond between the actuator frame and the substrate and a final protection layer may be applied over the conductive trace to protect the trace from mechanical or environmental damage.

Wire bonded common electrical connection in a piezoelectric micro-electro-mechanical system scanning mirror assembly

The description relates to computing devices that employ steerable optics. One example includes a steering mechanism and a base substrate positioned relative to the steering mechanism. The example also includes an optical substrate positioned over the base substrate and an adhesive complex securing the optical substrate relative to the base substrate with multiple different types of adhesives.

Steerable optical assemblies

A system that includes a substrate for microelectromechanical system (MEMS) scanning mirror systems is provided. The MEMS scanning mirror system includes a substrate that includes a ceramic body. An actuator frame is mounted on the ceramic body of the substrate. The actuator frame includes at least one moveable member. At least one actuator is operatively connected to the at least one moveable member such that the actuator is configured to move the at least one moveable member. A scanning mirror assembly is mounted to the at least one moveable member such that movement of the at least one moveable member moves the scanning mirror assembly.

Substrate for scanning mirror system

A piezoelectric MEMS scanning mirror system is provided. In particular, the efficiency and life of the system are improved by use of new bonding methods. Mechanical and electrical connections between the actuator frame of a piezoelectric MEMS scanning mirror system and the piezoelectric actuators in the system may be created using an anisotropic conductive adhesive. An anisotropic conductive adhesive only conducts electricity across the bond line between a lower portion of the piezoelectric actuator and a top of the metal frame. One way this is done is to provide a sparse loading of conductive particles. When the piezoelectric element is compressed against the frame, the conductive particles only form a conductive path across the bond line. Grit blasting, sanding, or chemical etching may be used to roughen the metal surface prior to bonding. A surface roughness between 2 RMS and 6 RMS may be created on the metal frame.

Anisotropic conductive adhesive bond in a piezoelectric micro-electro-mechanical system scanning mirror system

Examples are disclosed that relate to a resonant scanning mirror system comprising a mirror structure mounted to a frame via an adhesive. One example provides a resonant scanning mirror system comprising a frame defining a perimeter around a space, the frame including a mirror mounting portion having an opening. The mirror system also comprises a mirror structure spanning the space, the mirror structure having an oscillating mirror portion and a foot, the foot being attached to the mirror mounting portion with an adhesive and being positioned such that a location of the opening in the mirror mounting portion at least partially defines a location of an edge of a fillet of the adhesive where the adhesive meets the foot of the mirror structure.

Bonding of resonant oscillating mirror to frame

A micromirror actuator assembly includes a lower printed circuit board (PCB), an upper PCB, and a frame spaced away from the lower PCB and spaced away from the upper PCB between the lower PCB and the upper PCB. A micromirror is rotatably attached to the frame. A plurality of piezoelectric actuators are affixed to the frame and configured to selectively deform the frame to scan the micromirror.

Micromirror actuator assembly

A micro electro mechanical system is provided. The micro electro mechanical system includes a first part bonded to a second part by a structural adhesive interface. The structural adhesive interface includes a conductive structural adhesive portion, and a non-conductive structural adhesive portion at least partially surrounding the conductive structural adhesive portion. The conductive structural adhesive portion and the non-conductive structural adhesive portion have a thixotropy index greater than one.

Adhesive bonded micro electro mechanical system

Examples are disclosed that relate to actuator frames for scanning mirror systems. In one example an actuator frame for a scanning mirror assembly comprises a mounting member comprising a first side and an opposite second side. A first moveable member comprises a first interior side that defines a first gap and a second gap with the first side of the mounting member. A second moveable member comprises a second interior side that defines a third gap and a fourth gap with the second side of the mounting member. A first hinge connects a central portion of the mounting member with the first moveable member, and a second hinge connects the central portion of the mounting member with the second moveable member.

Actuator frame for scanning mirror

Various technologies described herein pertain to collocating a signal processing device with a micromechanical scanning silicon mirror as part of an apparatus. The micromechanical scanning silicon mirror and the signal processing device are part of separate dies. According to various embodiments, the apparatus can include wire bonds directly between sensor contacts of the micromechanical scanning silicon mirror and the signal processing device; the signal processing device can be mounted on a printed circuit board or mounted on or adjacent to the micromechanical scanning silicon mirror. Pursuant to other embodiments, the signal processing device can be mounted on the micromechanical scanning silicon mirror (e.g., mounted on a foot) and electrically coupled to sensor contacts of the micromechanical scanning silicon mirror (e.g., via wire bonds between the sensor contacts and the signal processing device or connectors that both mechanically and electrically connect the micromechanical scanning silicon mirror and the signal processing device).

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Mercer Island, WA, United States of America

Michael James Nystrom