Other

Sarnoff Corporation

Fry's Metals, Inc.

Lamina Ceramics, Inc.

Daewoo Electronics Co., Ltd.

Alpha Metals, Inc.

Sharp K.k.

Powerzyme, Inc.

Michael James Liberatore

Attiganal Narayanaswamy Sreeram

Leszek Hozer

Bawa Singh

Brian Lewis

Barry Jay Thaler

Ellen Schwartz Tormey

Aly Eid Fathy

Gerard R Minogue

Ashok Narayan Prabhu

Oscar Khaselev

Nitin Vithalbhai Desai

Siuli Sarkar

Michael T Marczi

Bernard Dov Geller

John P Laughlin

Sachin Parashar

Anthony E Ingham

Attiganal Narayanswamy Sreeram

David V Kyaw

Yun-Hwi Park

Sung-Dae Park

Je-Do Mun

In-Tae Kim

George Herbert Needham Riddle

Roger Casanova Alig

Rajan Kumar

Kalipada Palit

Zhonghui Hugh Fan

Joo-Dong Yu

Chetna Bindra

Hyun-Gyu Kang

Particles and particle films are provided. In certain examples, particles produced from a single phase process may be used to provide industrial scale synthesis of particles for use in devices such as printed wiring boards.

Particles and inks and films using them

A solder preform having multiple layers including a solder layer filled with additives interposed between two unfilled layers for improved wettability. A solder preform having a sphere which contains a solder material filled with additives, and an unfilled surface layer for improved wettability. A thermal interface material having a bonding component and an additive component which is a CTE modifying component and/or a thermal conductivity enhancement component. Active solders containing intrinsic oxygen getters.

Thermal interface material and solder preforms

Embedded, coupled, shaped waveguide resonators having conductive walls sandwiched between two fired green tape stacks, said conductive walls having apertures therein whose size and location determine the degree of coupling. These waveguides are made by forming openings in a first green tape stack, defining walls and apertures therein, mounting a second green tape stack having a conductive layer thereon thereover and firing the assembly. E-plane probes are inserted in openings in the second green tape stack and connected to microstrip transmission lines on an external surface pf this green tape stack.

High performance embedded RF filters

An electron gun as for a cathode ray tube includes a plurality of electrodes biased at different potentials to electrostatically shape and focus the one or more electron beams produced thereby. A dynamic focus grid is driven by a substantial ac voltage signal at the horizontal line rate, which signal is undesirably coupled through parasitic capacitance to an intermediate grid located between the dynamic focus grid and the gun anode. A resistive biasing network includes a high value resistance to divide the anode potential to develop bias potential for the intermediate grid and a capacitance to ac couple the intermediate grid to ground potential. The resistance is formed in a single layer ceramic circuit and the capacitance is formed on the single layer ceramic circuit or on the tube neck. The ceramic circuit may be located in the tube neck on or with the electron gun.

Electron gun with resistor and capacitor

A thermal interface material for use in electronic packaging, the thermal interface material comprises a solder with relatively high heat flow characteristics and a CTE modifying component to reduce or prevent damage due to thermal cycling. The thermal interface material comprises an active solder that contains indium and an intrinsic oxygen getter selected from the group consisting of alkali metals, alkaline-earth metals, refractory metals, rare earth metals and zinc and mixtures and alloys thereof. Lastly, damage due to an electronic package due to thermal cycling stress is reduced by using an insert in a lid of an electronic device package wherein the insert has a coefficient of thermal expansion that is between about that of the lid and about that of a semiconductor substrate.

Thermal interface material and heat sink configuration

Materials for making a plasma display having a transparent front panel spaced from a back panel which is a metal core having layers of a dielectric material extending over and bonded to the core. The materials of which the back panel is made are chosen to form a back panel having a thermal coefficient of expansion compatible with that of the front panel. The dielectric material is made from a green ceramic tape which is bonded to the core and cofired with the core to form the back panel. The materials for the dielectric can be chosen such that the composite TCE of the cofired assembly matches the TCE of the front panel.

Materials to fabricate a high resolution plasma display back panel

Provided is a fuel cell comprising a first compartment, a second compartment and a barrier separating the first and second compartments, wherein the barrier comprises a proton transporting moiety.

Enzymatic fuel cell

High dielectric constant capacitors are made from a dielectric ink of lead-magnesium-niobate and lead oxide powders. Dielectric inks are made by mixing the dielectric powders with a suitable organic vehicle which can be used to coat one or more glass-based green tapes. Buried capacitors are made by coating an overlying and an underlying green tape with a conductor such as silver. Capacitors can also be made by adjusting the organic vehicle and forming a green tape from the dielectric powders. These dielectric green tapes each can be coated with a conductive layer and stacked, the conductive layers connected in parallel. The resultant multilayer capacitors have a very high dielectric constant, while eliminating the need for very large area capacitors, as compared to single layer capacitors.

High dielectric constant embedded capacitors

Large value embedded inductors are made by screen printing an inductor coil onto one or more ferrite tapes, and covering the ferrite tapes with one or more ferrite tape layer or layers. Low firing temperature green tapes surround the ferrite layer or layers. These green tapes can be expansion matched to gallium arsenide.

Large value buried inductors in low temperature co-fired ceramic circuit

Embedded passive components such as capacitors are formed in multilayer ceramic circuit boards by screen printing a component precursor compound ink sandwiched between conductor ink layers onto a green tape stack and covering the component ink layer with one or two green tape layers, aligning and laminating the green tapes and firing. Capacitor inks are made from dielectrics chosen from barium titanate, titanium oxide and lead-magnesium-niobate. The green tapes are made of a mixture of a crystallizing glass, a non-crystallizing glass and an oxide filler which does not shrink in the x and y dimensions during firing mounted on a metal support. Thus the embedded components can be made to close tolerances.

Multilayer ceramic circuit boards including embedded components

Growing community of inventors

Lawrenceville, NJ, United States of America

Michael James Liberatore