Advanced Micro Devices Corporation

Michael James Dunn

Mark Brandon Fuselier

Roger Thomas Williams

Michael Verne Fenske

Stephen Doug Ray

An apparatus and method for verifying a process step in the fabrication of an integrated circuit device is implemented. A ring oscillator is fabricated on the dice constituting the integrated circuit device being manufactured. The ring oscillator structure is adapted for sensitizing the ring oscillator to variations in the process step being verified. During test of the wafer containing the dice, a scan of the frequency of the ring oscillator across the wafer for each die under test is made. Deviations in the ring oscillator frequency from a preselected nominal value delimit regions of the wafer for which the process step is marginal.

Apparatus and method for verifying process integrity

An apparatus and method for detecting speed variations across a die, a flash field, i.e., multiple dies, and multiple flash fields. In one embodiment, a method comprises the step of inserting a plurality of functional circuits at strategic locations across a die or flash field or multiple flash fields where each of the plurality of functional circuits generates data, e.g., values, frequency, etc., correlated to the die speeds at the strategic locations. The method further comprises reading the data generated by the plurality of functional circuits that may be correlated to the die speeds at the strategic locations. Speed variations across the die or flash field or multiple flash fields may then be subsequently detected based on the data generated by the plurality of functional circuits. Upon analyzing the data generated by the plurality of functional circuits, adjustments may be made to the manufacturing process to improve the number of acceptable integrated circuits or chips disposed in the dies.

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Austin, TX, United States of America

Michael James Dunn