Cisco Technology, Inc.

Applied Materials, Inc.

Lam Research Corporation

Novellus Systems Incorporated

Michael J Wood

Michal Danek

Samantha SiamHwa Tan

Anand Chandrashekar

Keren Jacobs Kanarik

Wenbing Yang

Chiukin Steven Lai

Teh-Tien Su

Sibrina Shafique

Dmitry Lubomirsky

Bart Jan Van Schravendijk

Robin W Cheung

Barry Lee Chin

John Stephen Drewery

Kaihan Abidi Ashtiani

Donald J K Olgado

Nerissa Sue Draeger

Moshe Sarfaty

Paul F Smith

Suraj Rengarajan

Kevin H Song

Lakshminarayana Nittala

Haojiang Li

Yaan Mirng Jeffrey Chen

Teh-Wei David Chen

Naohiro Shoda

Sajjad Chaudhary

Methods of depositing tungsten into high aspect ratio features using a dep-etch-dep process integrating various deposition techniques with alternating pulses of surface modification and removal during etch are provided herein.

Atomic layer etch of tungsten for enhanced tungsten deposition fill

Atomic layer etching of tungsten for enhanced tungsten deposition fill

Novel gap fill schemes involving depositing both flowable oxide films and high density plasma chemical vapor deposition oxide (HDP oxide) films are provided. According to various embodiments, the flowable oxide films may be used as a sacrificial layer and/or as a material for bottom up gap fill. In certain embodiments, the top surface of the filled gap is an HDP oxide film. The resulting filled gap may be filled only with HDP oxide film or a combination of HDP oxide and flowable oxide films. The methods provide improved top hat reduction and avoid clipping of the structures defining the gaps.

Gap fill integration

A system for determining static, dynamic and intelligent Virtual Route Forwarding routing for services traffic includes a data device and a network processing device. The network processing device is configured to: receive a data transmission from the data device, analyze the data transmission to identify a data characteristic other than a source or destination associated with the data transmission, create a packet, determine a transmission identifier associated with the data characteristic, and transmit the packet through a network path corresponding to the transmission identifier.

Static, dynamic and intelligent VRF routing for services traffic

A network device with a configurable interface. The device has at least two communication ports. An interface in communication with the ports is configurable as to the network layer, or layerand, and the physical layer, or layer. The interface includes at least two lines for transmitting data and two lines for receiving data and a processor that determines the data transmitted and received. The processor controls the data in accordance with the configuration parameters of the interface, which are each independently selectable.

Configurable basic rate interface

Embodiments of the invention provide an apparatus and method to determine the health of a substrate process such as, for example, a pre-clean process using plasma to remove copper oxide from a copper layer on a substrate, and the point at which the process has ended. In one aspect, optical characteristics and/or chamber impedance are used to determine the process end-point and/or process chamber health.

Method and apparatus for process monitoring

An apparatus and method for securing and electrically contacting a substrate on a non-production surface of the substrate. The apparatus includes a substrate holder assembly having a substrate engaging surface formed thereon, the substrate engaging surface being configured to engage a substrate on the non-production surface. The apparatus further includes an electrical contact device positioned on the substrate engaging surface, the electrical contact device including a plurality of radially spaced electrically conductive members configured to electrically communicate with the non-production surface of the substrate positioned on the substrate engaging surface. The method includes depositing a conductive seed layer on a production surface of the substrate, and depositing a backside conductive layer on a portion of the non-production side of the substrate, the backside conductive layer extending around a bevel of the substrate to electrically communicate with the seed layer. The method further includes securing the substrate in a chuck configured to engage the non-production surface of the substrate, contacting the backside conductive layer with an electrical cathode contact on the non-production side of the substrate, and plating over the conductive seed layer via application of an electrolyte to the production surface of the substrate and applying an electrical bias to the electrical cathode contact and an anode in communication with the electrolyte.

Apparatus and method for electro chemical plating using backside electrical contacts

A method for processing a substrate. The method generally includes forming a copper interconnect in a sacrificial layer deposited on the substrate by patterning the sacrifical layer to form an interconnect and filling the interconnect with copper. The method additionally includes removing at least a portion of the sacrificial layer upon copper interconnect formation, depositing a barrier layer on the copper interconnect, and depositing a dielectric layer on the barrier layer.

Post metal barrier/adhesion film

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Monte Sereno, CA, United States of America

Michael J Wood