Modine Manufacturing Company

Thermal Corporation

Michael J Wilson

Jonathan P Wattelet

Richard M DeKeuster

Kevin L Wert

Donald Lightner

Alfred L Phillips

Dmitry K Khrustalev

John Broadbent

Mark G Voss

Ernest H Dubble

Jon Horek

Gregg J Baldassarre

Gregory G Hughes

Milisav Lazarevic

The present invention provides an exhaust gas waste heat recovery heat exchanger including a housing having a working fluid inlet, a working fluid outlet, an exhaust inlet, and an exhaust outlet, an exhaust flow path extending through the housing between the exhaust inlet and the exhaust outlet, and a working fluid flow path extending through the housing between the working fluid inlet and the working fluid outlet and having a first portion and a second portion. A flow of working fluid along the first portion of the working fluid flow path can be substantially counter to a flow of exhaust along the exhaust flow path, and the flow of working fluid along the second portion of the working fluid flow path can be substantially parallel to the flow of exhaust along the exhaust flow path.

Heat recovery system and method

An exhaust gas waste heat recovery heat exchanger includes a housing having a working fluid inlet, a working fluid outlet, an exhaust inlet, and an exhaust outlet, an exhaust flow path extending through the housing between the exhaust inlet and the exhaust outlet, and a working fluid flow path extending through the housing between the working fluid inlet and the working fluid outlet and having a first portion and a second portion. A flow of working fluid along the first portion of the working fluid flow path can be substantially counter to a flow of exhaust along the exhaust flow path, and the flow of working fluid along the second portion of the working fluid flow path can be substantially parallel to the flow of exhaust along the exhaust flow path.

A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.

Liquid cooled heat sink with cold plate retention mechanism

A cooling system is provided for supplying a coolant flow to a cold plate associated with a processing chip of an electronic device to cool the processing chip. The system includes an electric motor driven fan; a radiator; an accumulator tank connected to the radiator for the transfer of coolant between the accumulator and the radiator; an electric driven pump connected to at least one of the radiator, the accumulator, and the cold plate to provide the coolant flow through the radiator and the cold plate; and a fan shroud adapted to direct the airflow provided by the fan. The fan, the radiator, the accumulator tank, and the pump are mounted on the shroud to be carried thereby, and the pump is located on an exterior side of the of the fan shroud and outside of the radiator and the accumulator tank.

Cooling system for computer electronics

A flexible loop thermosyphon is provided having a flexible, hermetic, outer tube and a flexible, non-hermetic, inner tube, positioned concentrically within the outer tube, forming an annulus between the outer tube and inner tube. The annulus acts as a vapor conduit transferring vapor to the loop thermosyphon condenser while the inner tube acts as a condensate conduit returning liquid to the loop thermosyphon evaporator.

Flexible loop thermosyphon

A heat exchanger for cooling a heat generating device is provided that includes a plurality of plates each defining at least one through-bore. The plates are laminated together to form a stack so that a plurality of enclosed chambers are formed by an alignment of a first portion of the through-bores within the block, and a plurality of passageways are formed by an alignment of a second portion of the through-bores within the stack such that at least one of the passageways is arranged in fluid communication with at least two of the chambers. A baffle-plate is disposed within a portion of the stack so as to form a chamber boundary and thereby to define a circuitous fluid flow path between the chambers through the at least one passageway. A fluid entrance port is defined in a first outer one of the plates and arranged in fluid communication with one of the chambers, and a fluid exit port is also defined in a second outer one of the plates and arranged in fluid communication with another one of the chambers.

Forced fluid heat sink

An improved heat exchanger includes a first tube () of generally circular cross section having a relatively large inside diameter and being U-shaped with opposite ends () adjacent one another. A second tube having a cross section that is relatively small in relation to the cross section of the first tube () and helical shaped section () intermediate its ends () is located within the first tube () and extends through caps () at the ends () of the first tube () to be received in headers (). The first tube () impales headers () and includes apertures () aligned with the headers () and in fluid communication with the interiors thereof.

Heat exchanger

A thermal management system for an electronic device is provided a first thermal energy transfer assembly that is thermally coupled between a heat generating structure located on a circuit card and a first thermal interface surface that is spaced away from the heat generating structure. A second thermal energy transfer assembly includes a second thermal interface surface which is arranged in confronting relation to the first thermal interface surface. A clamping mechanism is arranged to move the second thermal interface surface between (i) a first position that is spaced away from the first thermal interface surface, and (ii) a second position wherein the second thermal interface surface is pressed against the first thermal interface surface so as to allow the busing of thermal energy from the first thermal energy transfer assembly to the second thermal energy transfer assembly by heat transfer from the first thermal interface surface to the second thermal interface surface.

Growing community of inventors

Racine, WI, United States of America

Michael J Wilson