Advanced Micro Devices Corporation

Ati Technologies Ulc

Michael J Tresidder

Benjamin Tsien

Alexander J Branover

Gerald Robert Talbot

Thomas James Gibney

Pradeep Jayaraman

Prasant Kumar Vallur

Ramon Mangaser

Dean E Gonzales

Srikanth Reddy Gruddanti

Krishna Reddy Mudimela Venkata

David H Mcintyre

Shiqi Sun

Daniel Harvey McLean

Padmini Nujetti

Chao Yu

Nat Barbiero

YanFeng Wang

Systems and methods are disclosed for scheduling a data link training by a controller. The system and method include receiving an indication that a physical layer of a data link is not transferring data and initiating a training process of the physical layer of the data link in response to the indication that the physical layer of the data link is not transferring data. In one aspect, the indication that the physical layer of a data link is not transferring data is an indication that the physical layer of the data link is in a low power state. In another aspect, the indication that the physical layer of a data link is not transferring data is an indication that a data transfer has been completed.

Scheduling training of an inter-chiplet interface

The disclosed computer-implemented method for multi-lane data bus inversion can include receiving data for transmission via a plurality of data lanes, each data lane corresponding to one of a plurality of inversion bits, and, for each data lane within the plurality of data lanes, applying the corresponding inversion bit to each bit within the data lane. Various other methods, apparatuses, and systems are also disclosed.

Apparatuses, systems, and methods for multi-lane data bus inversion

Systems and methods are disclosed for voltage droop mitigation associated with a voltage rail that supplies power to circuitry of a chiplet. Techniques disclosed include detecting an upcoming transmission of data packets that are to be transmitted through a physical layer of the chiplet. Then, before transmitting the data packets through the physical layer, throttling a rate of bandwidth utilization in the physical layer and transmitting, by the controller, the data packets through the physical layer.

Droop mitigation for an inter-chiplet interface

Systems, apparatuses, and methods for enabling localized control of link states in a computing system are disclosed. A computing system includes at least a host processor, a communication fabric, one or more devices, one or more links, and a local link controller to monitor the one or more links. In various implementations, the local link controller detects and controls states of a link without requiring communication with, or intervention by, the host processor. In various implementations, this local control by the link controller includes control over the clock signals provided to the link. For example, the local link controller can directly control the frequency of a clock supplied to the link. In addition, in various implementations the link controller controls the power supplied to the link. For example, the link controller can control the voltage supplied to the link.

Dynamic fine grain link control

A semiconductor package for skew matching in a die-to-die interface, including: a first die; a second die aligned with the first die such that each connection point of a first plurality of connection points of the first die is substantially equidistant to a corresponding connection point of a second plurality of connection points of the second die; and a plurality of connection paths of a substantially same length, wherein each connection path of the plurality of connection paths couples a respective connection point of the first plurality of connection points to the corresponding connection point of the second plurality of connection points.

Skew matching in a die-to-die interface

Growing community of inventors

Austin, TX, United States of America

Michael J Tresidder