Rogers Corporation

Michael J Taylor

William P Harper

Richard T Traskos

Jeffrey B Otto

Samuel Gazit

Brett W Kilhenny

Leonard S Calabrese

A flexible circuit is presented having a flexing (cyclic bending) section of lower stiffness than adjacent parts of the circuit. The lower stiffness in the flexing section is achieved by reducing the thickness of the flexing section, either by omitting or removing some or all of the dielectric material of the flexible circuit in the flexing section, or by replacing conventional dielectric material in the flexing section with a polymer of lower modulus of elasticity.

Flexible circuit having flexing section of reduced stiffness, and method

A novel method of assembling miniaturized bus bars is presented wherein capacitor ribbons are formed having discrete capacitive elements retained within an insulating layer. These capacitor ribbons are positioned between a pair of bus bar conductor plates with the capacitive elements placed in electrical contact with the plates. The ribbon and bus bar conductor plates are retained together by any conventional technique.

Miniaturized bus bar with capacitors and method of making same

A method of assembling a miniaturized bus bar which has high capacitance comprises forming a layer of ceramic material directly upon a bus bar conductor or directly upon a supporting metal strip which is attached to a first bus bar conductor. The exposed surface of the layer of ceramic material is subsequently mechanically and electrically bonded to a second bus bar conductor which extends parallelly with respect to the first bus conductor.

High capacitance bus bar manufacturing technique

An improved method of manufacturing electrical and electronic circuits is provided wherein an improved conductive ink is employed to define the pathways of current flow. This improved conductive ink is comprised of conductive particles, thermosetting binder and a multifunctional isocyanate. The isocyanate provides cross-linking between the conductive ink binder and the surface upon which the ink is applied and establishes a bond with enhanced moisture durability.

Conductive ink

Circuitry component

A high capacitance bus bar is presented having at least two separated conductive plates between which a plurality of capacitive ceramic dielectric chips are positioned and adhered. The outer surfaces of the dielectric chips are metalized and have a roughened or coarse finish to provide contact between the dielectric chips and the conductive plates, thereby permitting use of nonconductive adhesive to bond the parts of the assembly together.

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Mesa, AZ, United States of America

Michael J Taylor