Olin Corporation

Swiss Aluminium Ltd.

Kb Alloys

Virginia

Michael J Pryor

Joseph Winter

Derek E Tyler

Eugene Shapiro

William C Setzer

Deepak Mahulikar

Jonathan A Dantzig

Jacob Crane

James M Popplewell

Andrew J Brock

Narendra N Singhdeo

Norman G Masse

Charles J Leedecke

Sam Friedman

John C Yarwood

Julius C Fister

Harvey P Cheskis

Robert A Rapp

William L Brenneman

Michael Leonard Santella

Stanley Shapiro

William H Anthony

Noel Jarrett

David K Young

Thomas J Gray

Francis P Koch

John F Breedis

Sheldon H Butt

Edward F Smith

Gary L Ungarean

Ronald N Caron

William G Watson

Satyam C Cherukuri

Peter E Sevier

Douglas L Graham

James A Ford

Alexander F Beck

Phillip A Chatfield

Louis P Stone

Murray A Heine

Richard A Eppler

Sheldon W Dean

John Shabarack

Aluminum base alloy consisting essentially of from 0.1 to 3.0% boron, from 1 to 10% titanium and the balance essentially aluminum wherein the aluminum matrix contains TiB.sub.2 particles dispersed throughout said matrix having an average particle size of less than 1 micron, and wherein the matrix contains clusters of said TiB.sub.2 particles greater than 10 microns in size with an average of less than 4 of said clusters per 2 cm.sup.2. The alloy is prepared by adding a boron containing material selected from the group consisting of borax, boron oxide, boric acid and mixtures thereof, and K.sub.2 TiF.sub.6 to a bath of molten aluminum and stirring the molten mixture.

Aluminum base alloy

Aluminum base alloy and method for preparing same

A process for etching copper or a copper base material with an aqueous solution consisting essentially of peroxydisulfuric acid, up to about 500 ppm of a halide addition and the balance water is described. The process includes off-line generation/regeneration of the etching solution. An electrochemical cell for generating/regenerating the etching solution is also described.

Process for etching copper base materials

A process and apparatus for fabricating an optical fiber cable core assembly having at least one optical fiber encapsulated with an ultra-small diameter metallic tube are described. The optical fiber cable core assembly is formed by passing a metal or metal alloy strip through at least one die to form the ultra-small diameter tube, inserting at least one optical fiber or fibers into the tube during the tube formation operation and passing the assembly through a sealing station to seal the tube and provide a hermetic core assembly. To reduce the likelihood of breaking the tube and damaging the optical fiber or fibers therein, the deformation energy for forming the strip into the tube is provided by wrapping the assembly about a tensioning device positioned between the tube forming station and the tube sealing station.

Method and apparatus for forming ultra-small optical fiber cable

A semiconductor die attach system adapted for attaching a semiconductor die to a substrate is provided. A metallic buffer component for dissipating thermal stresses is disposed between the substrate and the semiconductor die to dissipate stresses created from thermal cycling of the substrate and the die. The metallic buffer component is sealed between the substrate and the die with a silver-tin sealing composition. A bonding material may be used alone to bond a die to a substrate and dissipate stresses from thermal cycling.

Semiconductor die attach system

An optical fiber communication cable comprises providing at least one optical fiber and surrounding the optical fiber with a high strength drawn copper alloy tube having a generally longitudinally extending seam. The edges of the tube which define the seam are substantially nonlinear deformed edges whose length from the outside of the tube to the inside thereof exceeds the thickness of the tube wall.

Optical fiber communication cable having a high strength, drawn copper

The process of constructing a multi-layer glass-ceramic circuit is disclosed. One or more glass-ceramic substrates is formed from a slurry or molten glass particles and ceramic which was formed at a temperature wherein the glass particles are molten and the ceramic particles are solid. After an electrical conductor pattern is applied on at least a surface of one of the glass-ceramic structures, at least two glass-ceramic structures are stacked on one another with the electrical conductor pattern therebetween and heated until the glass of each glass-ceramic structure bonds with adjacent glass so as to form the multi-layer structure.

Method for making multi-layer and pin grid arrays

A hermetically sealed package adapted to house a plurality of semiconductor devices. The package include a multi-layer circuit device formed of a plurality of ceramic substrates and conductive circuit patterns disposed therebetween. A ceramic cover having at least one cavity adapted for receiving a semiconductor die is sealed to the multi-layer circuit device. Electrical leads are connected to the semiconductor device and extend outward from the package for connection to the conductive circuit pattern within the multi-layer circuit.

Hermetically sealed package

The present invention is directed to several embodiments of a hermetically sealed semiconductor package. One embodiment is constructed from a substrate of a first copper alloy, a cover member of a second copper alloy and a lead frame of a third copper alloy. A low melting point sealing glass composite is disposed between the cover member and the substrate for sealing the lead frame therebetween. The third copper alloy is precipitation hardenable and has excellent softening resistance at glass sealing temperatures as compared with other conventionally used alloys. In another embodiment, a clad composite having a core of the third copper alloy and cladding layer of a copper alloy having a low oxidation rate may be advantageously used for the lead frame.

Hermetically sealed semiconductor package

The present invention is directed to a cermet material comprising a matrix of aluminum alloy with ceramic particles distributed therein. The cermet is adapted for use as a semiconductor substrate and is manufactured using powder technology procedures. The cermet comprises from about 40 to about 60 volume % of aluminum or aluminum alloy, from an effective amount up to about 10 volume % of binder for enhancing bonding between the aluminum alloy and ceramic particles, and the balance essentially ceramic particles.

Cermet substrate with spinel adhesion component

A hollow tubular structure having edges held in close proximity by residual compressive forces in the material forming the tubular structure is formed by first drawing a metal or metal alloy strip through a first die and forming an open tube section and then drawing the open tube section through a second die. The hollow tubular structures have particular utility in optical fiber communication cable constructions.

Optical fiber cable assemblies

A process and apparatus for producing increased reductions in strip material, particularly soft metal strip materials, are disclosed. The process and apparatus utilize a rolling mill having at least two offset work rolls driven at a peripheral speed ratio less than a desired gage reduction ratio but greater than zero and a mechanism for applying forward tension to the strip material. The desired gage reduction may be obtained using reduced separating force magnitudes and minimized tension force magnitudes. The rolling mill utilizes relatively small diameter work rolls without having to provide additional support structures other than the back-up rolls and frame roll supports to prevent roll bending in the rolling direction. Roll flattening is substantially eliminated resulting in improved gage control and strip flatness.

Process and apparatus for producing high reduction in soft metal

A method of joining metallic layers of foil is disclosed. The layers of foil are spaced apart from each other a desired distance. A metallic component disposed between the layers of foil is in selective contact with each of them. The metallic component is selected to be in the semi-solid condition at a desired processing temperature. The assembly is heated to the processing temperature. The the assembly is cooled so that the metallic component is bonded to the metallic layers of foil.

Method of joining metallic components

An optical fiber communication cable and a process for making it comprise providing at least one optical fiber and surrounding the optical fiber with a high strength drawn copper alloy tube having a generally longitudinally extending seam. The edges of the tube which define the seam are substantially nonlinear deformed edges whose length from the outside of the tube to the inside thereof exceeds the thickness of the tube wall.

Method for assembling an optical fiber communication cable

Growing community of inventors

Woodbridge, CT, United States of America

Michael J Pryor