Motorola Corporation

Temic Automotive of North America, Inc.

Michael J Pfeifer

Anthony J Polak

Thomas P Gall

Joe Pin Wang

George W Marlin

Michael J Pomeroy

Cheryl B Field

An electronic control module comprising a vent assembly is provided. The electronic control module comprises a housing having a first aperture and a substrate disposed within the housing. The substrate has a second aperture positioned adjacent to the first aperture, and includes the hydrophobic vent assembly disposed over the second aperture and adheringly coupled to the substrate. The hydrophobic vent assembly may be adapted to prevent the ingress of moisture and permit the egress of certain gases.

Apparatus for venting an electronic control module

A microdevice assembly () that includes a device microstructure (), a housing (), and a fine grain getter layer (). The housing () has a base portion () and a lid (). The device microstructure () is attached to the base portion () and the lid () is hermetically sealed to the base portion (). The housing () defines a cavity () surrounding the device microstructure (). The fine grain getter layer () is on an interior side () of the lid () for maintaining a vacuum in the cavity () surrounding the device microstructure (). The lid () may be made of metal or have at least a metallic surface in the region where the fine grain getter layer () is applied. The fine grain getter layer () has a sub-micron grain size. There is also a method for making the microdevice assembly ().

Microdevice assembly having a fine grain getter layer for maintaining vacuum

Flip chip bumps (24, 26, and 27) and an inductor (17) are simultaneously fabricated on a semiconductor substrate (10). The fabrication process includes two electroplating steps. The first step electroplates copper (18) onto a seed layer (13) to form the inductor (17) and a first portion (16) of the flip chip bumps (24, 26, and 27). The second step electroplates copper (21) onto the previously electroplated copper (18) to form a second portion (21) of the flip chip bumps (24, 26, and 27).

Method of fabricating a flip chip semiconductor device having an inductor

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Chandler, AZ, United States of America

Michael J Pfeifer